MPC870VR66 vs MPC875VR80 Vergleich
Detaillierter Direktvergleich von MPC870VR66 von NXP Semiconductors und MPC875VR80 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC870VR66 | MPC875VR80 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 core |
| Datenbusbreite | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| Betriebsversorgungsspannung | 3.3 V | — |
| Betriebstemperaturbereich | 0C to +95C | — |
| Gehäuse / Bauform | 256-BGA (PBGA), 23x23 mm | — |
| Montageart | Surface Mount | Surface-mount BGA |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | unknown |
| Processor Type | MPC8xx PowerQUICC Communications Processor | MPC8xx communications microprocessor |
| Core Architecture | — | 32-bit Power Architecture |
| Maximale Taktfrequenz | — | 80 MHz |
| Versorgungsspannung | — | 3.3 V |
| Process Technology | — | 0.18 µm |
| Package Type | — | 256-ball PBGA (23 x 23 mm) |
| Device Category | — | Microprocessor (MPU) |
| Betriebstemperatur | — | 0°C to 95°C |
| Memory Management | — | Memory-management units included |
| Instruction Cache | — | [DATA_NEEDED: instruction cache size] |
| Data Cache | — | [DATA_NEEDED: data cache size] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| Maximum Operating Current | — | [DATA_NEEDED: maximum operating current] |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |