MPC870VR66 vs MPC875VR80 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870VR66 disebabkan oleh NXP Semiconductors dan MPC875VR80 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC870VR66 | MPC875VR80 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 core |
| Lebar Bus Data | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| Tegangan Pemberi Arus Operasi | 3.3 V | — |
| Gambaran Suhu Operasi | 0C to +95C | — |
| Kemasan / Case | 256-BGA (PBGA), 23x23 mm | — |
| Jenis Pemasangan | Surface Mount | Surface-mount BGA |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | unknown |
| Processor Type | MPC8xx PowerQUICC Communications Processor | MPC8xx communications microprocessor |
| Core Architecture | — | 32-bit Power Architecture |
| Frekuensi Klock Maksimum | — | 80 MHz |
| Tegangan Pemberi Arus | — | 3.3 V |
| Process Technology | — | 0.18 µm |
| Package Type | — | 256-ball PBGA (23 x 23 mm) |
| Device Category | — | Microprocessor (MPU) |
| Suhu Operasi | — | 0°C to 95°C |
| Memory Management | — | Memory-management units included |
| Instruction Cache | — | [DATA_NEEDED: instruction cache size] |
| Data Cache | — | [DATA_NEEDED: data cache size] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| Maximum Operating Current | — | [DATA_NEEDED: maximum operating current] |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |