MPX2100AP vs MPX2100D Comparison

Detailed side-by-side comparison of MPX2100AP by STMicroelectronics and MPX2100D by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ Active

Specification Comparison

Parameter MPX2100AP MPX2100D
Brand STMicroelectronics NXP Semiconductors
Category Pressure Sensors Pressure Sensors
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $11.85 $17.80
Pressure Type Absolute Differential
Operating Pressure Range 0 to 100 kPa (0 to 14.5 psi) 0 kPa to 100 kPa (0 to 14.5 psi)
Output Type Analog Voltage (Wheatstone bridge) Analog ratiometric Wheatstone bridge (millivolts)
Full-Scale Output Span 40 mV typical at 10 V excitation —
Offset (Zero Pressure) 0 mV typical —
Excitation Voltage 10 V DC typical —
Linearity ±0.25% (Full-Scale Span) 0.1% to 0.3% typical [DATA_NEEDED: confirm]
Temperature Compensation On-chip, ±0.5% over 0°C to 85°C —
Operating Temperature Range -40°C to +125°C -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
Storage Temperature Range [DATA_NEEDED: storage temperature range] —
Port Style Axial Male Tube, 0.19 inch (4.93 mm) —
Package Type 4-SIP Module —
Sensor Technology Silicon Piezoresistive —
Media Compatibility Dry gases (non-corrosive) —
Mounting Type Through-Hole (SIP) Through-hole SIP module
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant [DATA_NEEDED: confirm from NXP product page]
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Package — 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]

Datasheets & Resources

Browse All Products Create BOM Request Quote