MPX2100AP vs MPX2100D Vergleich

Detaillierter Direktvergleich von MPX2100AP von STMicroelectronics und MPX2100D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ Aktiv

Spezifikationsvergleich

Parameter MPX2100AP MPX2100D
Marke STMicroelectronics NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $11,85 $17,80
Pressure Type Absolute Differential
Operating Pressure Range 0 to 100 kPa (0 to 14.5 psi) 0 kPa to 100 kPa (0 to 14.5 psi)
Ausgangstyp Analog Voltage (Wheatstone bridge) Analog ratiometric Wheatstone bridge (millivolts)
Full-Scale Output Span 40 mV typical at 10 V excitation —
Offset (Zero Pressure) 0 mV typical —
Excitation Voltage 10 V DC typical —
Linearity ±0.25% (Full-Scale Span) 0.1% to 0.3% typical [DATA_NEEDED: confirm]
Temperature Compensation On-chip, ±0.5% over 0°C to 85°C —
Betriebstemperaturbereich -40°C to +125°C -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
Storage Temperature Range [DATA_NEEDED: storage temperature range] —
Port Style Axial Male Tube, 0.19 inch (4.93 mm) —
Package Type 4-SIP Module —
Sensor Technology Silicon Piezoresistive —
Media Compatibility Dry gases (non-corrosive) —
Montageart Through-Hole (SIP) Through-hole SIP module
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant [DATA_NEEDED: confirm from NXP product page]
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Gehäuse — 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]

Datenblätter & Ressourcen

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