MPX2100AP vs MPX2100D Comparación

Comparación detallada lado a lado de MPX2100AP por STMicroelectronics y MPX2100D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ Activo

Comparación de especificaciones

Parámetro MPX2100AP MPX2100D
Marca STMicroelectronics NXP Semiconductors
Categoría Pressure Sensors Pressure Sensors
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $11,85 $17,80
Pressure Type Absolute Differential
Operating Pressure Range 0 to 100 kPa (0 to 14.5 psi) 0 kPa to 100 kPa (0 to 14.5 psi)
Tipo de salida Analog Voltage (Wheatstone bridge) Analog ratiometric Wheatstone bridge (millivolts)
Full-Scale Output Span 40 mV typical at 10 V excitation —
Offset (Zero Pressure) 0 mV typical —
Excitation Voltage 10 V DC typical —
Linearity ±0.25% (Full-Scale Span) 0.1% to 0.3% typical [DATA_NEEDED: confirm]
Temperature Compensation On-chip, ±0.5% over 0°C to 85°C —
Rango de temperatura de funcionamiento -40°C to +125°C -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
Storage Temperature Range [DATA_NEEDED: storage temperature range] —
Port Style Axial Male Tube, 0.19 inch (4.93 mm) —
Package Type 4-SIP Module —
Sensor Technology Silicon Piezoresistive —
Media Compatibility Dry gases (non-corrosive) —
Tipo de montaje Through-Hole (SIP) Through-hole SIP module
Estado RoHS [DATA_NEEDED: RoHS compliance status] Compliant [DATA_NEEDED: confirm from NXP product page]
Nivel MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Encapsulado — 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]

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