S9S08DZ60F2MLHR vs MC9S08DN60ACLH Comparison

Detailed side-by-side comparison of S9S08DZ60F2MLHR by NXP Semiconductors and MC9S08DN60ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08DZ60F2MLHR S9S08DZ60F2MLHR - 8-bit S08 MCU 60KB Flash 40MHz | NXP

S9S08DZ60F2MLHR - 8-bit S08 MCU 60KB Flash 40MHz | NXP

S9S08DZ60F2MLHR ✓ Active
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Specification Comparison

Parameter S9S08DZ60F2MLHR MC9S08DN60ACLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $4.08 $5.21
Core Architecture HCS08 (S08) 8-bit CISC —
Maximum CPU Frequency 40 MHz —
Program Memory (Flash) 60 KB (60K x 8) 60 KB (60K x 8)
RAM 2 KB [DATA_NEEDED: exact value] —
EEPROM [DATA_NEEDED: exact value] Embedded (size [DATA_NEEDED: EEPROM size])
Operating Voltage Range 2.7 V to 5.5 V —
Package 64-LQFP (10x10 mm) —
Pin Count 64 —
Mounting Type Surface Mount Surface Mount
Operating Temperature Range -40C to +125C (automotive) —
CAN Controller 1 x CAN 2.0 A/B (MSCAN) —
ADC 12-bit SAR [DATA_NEEDED: channel count] 16-channel, 12-bit, 2.5 us conversion
LCD Driver Yes, integrated segment LCD driver —
AEC-Q100 Qualification Yes (automotive grade) —
RoHS Status Compliant (per distributor listings) Compliant
Lead-Free / Halogen-Free [DATA_NEEDED] —
Core — HCS08 (S08 core)
Data Bus Width — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
RAM Size — 2 KB (2K x 8)
Number of I/O — 53
Package / Case — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Operating Temperature — -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Packaging — Tray
Instruction Set — HC08 + BGND instruction
On-Chip Debug — BDM (Background Debug Mode)

Datasheets & Resources

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