S9S08DZ60F2MLHR vs MC9S08DN60ACLH Comparação
Comparação detalhada lado a lado de S9S08DZ60F2MLHR por NXP Semiconductors e MC9S08DN60ACLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | S9S08DZ60F2MLHR | MC9S08DN60ACLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,08 | $5,21 |
| Core Architecture | HCS08 (S08) 8-bit CISC | — |
| Maximum CPU Frequency | 40 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | 60 KB (60K x 8) |
| RAM | 2 KB [DATA_NEEDED: exact value] | — |
| EEPROM | [DATA_NEEDED: exact value] | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Encapsulamento | 64-LQFP (10x10 mm) | — |
| Contagem de pinos | 64 | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Faixa de temperatura de operação | -40C to +125C (automotive) | — |
| CAN Controller | 1 x CAN 2.0 A/B (MSCAN) | — |
| ADC | 12-bit SAR [DATA_NEEDED: channel count] | 16-channel, 12-bit, 2.5 us conversion |
| LCD Driver | Yes, integrated segment LCD driver | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED] | — |
| Core | — | HCS08 (S08 core) |
| Largura do barramento de dados | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| RAM Size | — | 2 KB (2K x 8) |
| Number of I/O | — | 53 |
| Encapsulamento / Caixa | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Temperatura de operação | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Packaging | — | Tray |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |