SPAK56F803BU80 vs DSP56F803BU80E Comparação

Comparação detalhada lado a lado de SPAK56F803BU80 por NXP Semiconductors e DSP56F803BU80E por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
SPAK56F803BU80 SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 Nrnd
NXP Semiconductors
DSP56F803BU80E DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP

DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP

DSP56F803BU80E ✗ Fim de vida

Comparação de especificações

Parâmetro SPAK56F803BU80 DSP56F803BU80E
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida NRND Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $16,25 $0,00
Product Type 16-bit Digital Signal Processor —
Core Architecture DSP56F803 (DSP + MCU unified core) —
Core Frequency 80 MHz —
Core Performance 40 MIPS —
Instruction Set MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops —
Addressing Modes 14 addressing modes —
Program Memory On-chip Flash (size [DATA_NEEDED: program memory size in KB]) —
Data Memory On-chip RAM (size [DATA_NEEDED: data memory size in KB]) —
Encapsulamento LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) —
Package Outline 100 terminals, square, gull-wing lead form —
Operating Temperature Grade Industrial —
Tipo de montagem Surface Mount Surface Mount
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Typical Applications Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning —
Core Processor — 56800
Core Size — 16-bit
Series — 56F8xx
Frequência máxima de clock — 80 MHz
Performance — 40 MIPS (80MHz/40MIPS per Mouser)
Program Memory Size — 64 KB (32K x 16)
Program Memory Type — Flash
Architecture — Harvard-style, DSP + MCU hybrid
Connectivity — CANbus, EBI/EMI, SCI
Package Type — 100-LQFP (14x14 mm), LFQFP, square, gull wing
Number of Terminals — 100
Temperature Grade — Industrial
Packaging — Tray
Product Status — End of Life (EOL) per NXP product page
Tensão de alimentação de operação — [DATA_NEEDED: operating supply voltage]
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]

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