SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Comparison
Detailed side-by-side comparison of SPC5643LFF2MMM1R by NXP Semiconductors and SPC5642AF2MVZ3 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ Active
Specification Comparison
| Parameter | SPC5643LFF2MMM1R | SPC5642AF2MVZ3 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.85 | $0.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | — |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| Operating Temperature Range | -40 °C to +125 °C (automotive grade) | -40°C to +105°C |
| Package | 257-LFBGA / MAPBGA 14x14 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | — |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | — |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| Device Type | — | 32-bit automotive microcontroller |
| Processor Core | — | Power Architecture core |
| Architecture | — | 32-bit |
| Maximum Operating Frequency | — | 80 MHz |
| Flash Memory | — | 2 MB |
| Flash Organization | — | 2M x 8 bits |
| Family | — | MPC56xx Qorivva |
| Temperature Grade | — | Automotive Grade |
| Package Type | — | PBGA-324 |
| Package Body Size | — | 23 mm x 23 mm |
| Terminal Form | — | Ball |
| Intended Applications | — | Powertrain, chassis, engine control, transmission control, and industrial applications |
| Supply Voltage | — | [DATA_NEEDED: Supply Voltage] |
| RAM Memory | — | [DATA_NEEDED: RAM Memory] |
| Number of I/O Pins | — | [DATA_NEEDED: Number of I/O Pins] |
| Security and Diagnostics Features | — | [DATA_NEEDED: Security and Diagnostics Features] |