SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Comparaison
Comparaison détaillée côte à côte de SPC5643LFF2MMM1R par NXP Semiconductors et SPC5642AF2MVZ3 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | SPC5643LFF2MMM1R | SPC5642AF2MVZ3 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $24,85 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | — |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| Plage de température de fonctionnement | -40 °C to +125 °C (automotive grade) | -40°C to +105°C |
| Boîtier | 257-LFBGA / MAPBGA 14x14 mm | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | — |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | — |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| Device Type | — | 32-bit automotive microcontroller |
| Processor Core | — | Power Architecture core |
| Architecture | — | 32-bit |
| Maximum Operating Frequency | — | 80 MHz |
| Flash Memory | — | 2 MB |
| Flash Organization | — | 2M x 8 bits |
| Family | — | MPC56xx Qorivva |
| Temperature Grade | — | Automotive Grade |
| Package Type | — | PBGA-324 |
| Package Body Size | — | 23 mm x 23 mm |
| Terminal Form | — | Ball |
| Intended Applications | — | Powertrain, chassis, engine control, transmission control, and industrial applications |
| Tension d'alimentation | — | [DATA_NEEDED: Supply Voltage] |
| RAM Memory | — | [DATA_NEEDED: RAM Memory] |
| Number of I/O Pins | — | [DATA_NEEDED: Number of I/O Pins] |
| Security and Diagnostics Features | — | [DATA_NEEDED: Security and Diagnostics Features] |