SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Vergleich

Detaillierter Direktvergleich von SPC5643LFF2MMM1R von NXP Semiconductors und SPC5642AF2MVZ3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktiv
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Aktiv

Spezifikationsvergleich

Parameter SPC5643LFF2MMM1R SPC5642AF2MVZ3
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $24,85 $0,00
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) —
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
Betriebstemperaturbereich -40 °C to +125 °C (automotive grade) -40°C to +105°C
Gehäuse 257-LFBGA / MAPBGA 14x14 mm —
Montageart Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) —
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) —
Lead-Free / RoHS Compliant (lead-free BGA) —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Versorgungsspannung — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Number of I/O Pins — [DATA_NEEDED: Number of I/O Pins]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

Datenblätter & Ressourcen

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