SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Comparación
Comparación detallada lado a lado de SPC5643LFF2MMM1R por NXP Semiconductors y SPC5642AF2MVZ3 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ Activo
Comparación de especificaciones
| Parámetro | SPC5643LFF2MMM1R | SPC5642AF2MVZ3 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,85 | $0,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | — |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C (automotive grade) | -40°C to +105°C |
| Encapsulado | 257-LFBGA / MAPBGA 14x14 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | — |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | — |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| Device Type | — | 32-bit automotive microcontroller |
| Processor Core | — | Power Architecture core |
| Architecture | — | 32-bit |
| Maximum Operating Frequency | — | 80 MHz |
| Flash Memory | — | 2 MB |
| Flash Organization | — | 2M x 8 bits |
| Family | — | MPC56xx Qorivva |
| Temperature Grade | — | Automotive Grade |
| Package Type | — | PBGA-324 |
| Package Body Size | — | 23 mm x 23 mm |
| Terminal Form | — | Ball |
| Intended Applications | — | Powertrain, chassis, engine control, transmission control, and industrial applications |
| Tensión de alimentación | — | [DATA_NEEDED: Supply Voltage] |
| RAM Memory | — | [DATA_NEEDED: RAM Memory] |
| Number of I/O Pins | — | [DATA_NEEDED: Number of I/O Pins] |
| Security and Diagnostics Features | — | [DATA_NEEDED: Security and Diagnostics Features] |