SPC5643LFF2MMM1R vs SPC5642AF2MVZ3 Сравнение

Подробное сравнение бок о бок SPC5643LFF2MMM1R от NXP Semiconductors и SPC5642AF2MVZ3 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Активен
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Активен

Сравнение характеристик

Параметр SPC5643LFF2MMM1R SPC5642AF2MVZ3
Бренд NXP Semiconductors NXP Semiconductors
Категория Microcontrollers Microcontrollers
Статус жизненного цикла Активен Активен
Наличие In Stock In Stock
Цена за единицу (USD) $24,85 $0,00
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) —
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
Диапазон рабочих температур -40 °C to +125 °C (automotive grade) -40°C to +105°C
Корпус 257-LFBGA / MAPBGA 14x14 mm —
Тип монтажа Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) —
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) —
Lead-Free / RoHS Compliant (lead-free BGA) —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Напряжение питания — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Number of I/O Pins — [DATA_NEEDED: Number of I/O Pins]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

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