XC3S200-4FTG256I vs XC3S200-4FT256C Comparison
Detailed side-by-side comparison of XC3S200-4FTG256I by Xilinx and XC3S200-4FT256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S200-4FTG256I | XC3S200-4FT256C |
|---|---|---|
| Brand | Xilinx | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Spartan-3 | — |
| System Gates | 200,000 | 200000 |
| Logic Cells | 4,320 | 4320 |
| Slices | 2,160 | — |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) | — |
| Dedicated Multipliers | 4 (18x18) | — |
| DCM (Digital Clock Manager) | 4 | — |
| Maximum User I/O | 173 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm | 90 nm |
| Package | 256-ball FTBGA (FTG256), 17 x 17 mm | 256-LBGA |
| Operating Temperature | -40C to +100C (Industrial) | 0°C to 85°C |
| Mounting Type | Surface Mount (BGA) | — |
| Terminal Form | Ball | Ball |
| Peak Reflow Time | 30 s | — |
| RoHS Status | Compliant (G suffix = lead-free) | — |
| Device Type | — | FPGA |
| FPGA Family | — | Spartan-3 |
| Configurable Logic Blocks | — | 480 |
| Maximum Clock Frequency | — | 630 MHz |
| Nominal Core Supply Voltage | — | 1.2 V |
| Maximum Supply Voltage | — | 1.26 V |
| Number of Terminals | — | 256 |
| Package Shape | — | Square |
| Temperature Grade | — | Commercial |
| Lead-Free Status | — | Lead free |
| Typical Application | — | Cost-sensitive high-performance programmable logic |
| I/O Standard Support | — | [DATA_NEEDED: supported I/O standards] |
| Core Current | — | [DATA_NEEDED: core current] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory] |