XC3S200-4FTG256I vs XC3S200-4FT256C 对比

详细并排对比 XC3S200-4FTG256I 出自 Xilinx 和 XC3S200-4FT256C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Xilinx
XC3S200-4FTG256I XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

XC3S200-4FTG256I ✓ 量产中
AMD
XC3S200-4FT256C XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx

XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx

XC3S200-4FT256C ✓ 量产中

规格对比

参数 XC3S200-4FTG256I XC3S200-4FT256C
品牌 Xilinx AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Spartan-3 —
System Gates 200,000 200000
Logic Cells 4,320 4320
Slices 2,160 —
Block RAM 216 Kbit (12 blocks x 18 Kbit) —
Dedicated Multipliers 4 (18x18) —
DCM (Digital Clock Manager) 4 —
Maximum User I/O 173 —
Core Voltage 1.2 V —
Speed Grade -4 -4
Process Technology 90 nm 90 nm
封装 256-ball FTBGA (FTG256), 17 x 17 mm 256-LBGA
工作温度 -40C to +100C (Industrial) 0°C to 85°C
安装类型 Surface Mount (BGA) —
Terminal Form Ball Ball
Peak Reflow Time 30 s —
RoHS 状态 Compliant (G suffix = lead-free) —
Device Type — FPGA
FPGA Family — Spartan-3
Configurable Logic Blocks — 480
最大时钟频率 — 630 MHz
Nominal Core Supply Voltage — 1.2 V
Maximum Supply Voltage — 1.26 V
Number of Terminals — 256
Package Shape — Square
Temperature Grade — Commercial
Lead-Free Status — Lead free
Typical Application — Cost-sensitive high-performance programmable logic
I/O Standard Support — [DATA_NEEDED: supported I/O standards]
Core Current — [DATA_NEEDED: core current]
Configuration Memory — [DATA_NEEDED: configuration memory]

数据手册与资源

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