FPGA & CPLD
Produkte (6556)
XC7Z030-2SBG485I - Zynq-7000 SoC, 125K Logic Cells | AMD
The AMD XC7Z030-2SBG485I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including automotive, medical, and industrial systems. The device is housed in a 484-ball FCBGA package (19x19 mm) and operates at a maximum frequency of 800 MHz. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically merges a hard ARM-based processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture enables high-performance, low-latency processing that is not achievable with traditional microprocessors or FPGAs alone. Key features of the XC7Z030-2SBG485I include 125,000 logic cells, dual ARM Cortex-A9 cores running at 800 MHz, and a 28nm process technology. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The 'I' suffix indicates an industrial temperature grade, with an operating range of -40°C to +100°C, making it suitable for harsh environments. From a technical perspective, the Zynq-7000 architecture provides a high-bandwidth interconnect between the PS and PL, enabling efficient data transfer. The device includes a memory management unit (MMU) for the ARM cores, as well as a rich set of peripherals including USB, Ethernet, and SPI. The programmable logic can be configured to implement custom peripherals, DSP blocks, or even soft-core processors, offering unparalleled design flexibility. Typical applications for the XC7Z030-2SBG485I include software-defined radio, motor control, image processing, and automotive driver assistance systems. The combination of a powerful processor and reconfigurable logic makes it an excellent choice for systems that require both high-level control and real-time signal processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate ground planes and thermal vias to ensure reliable operation at high temperatures.
XC7Z035-2FFG676I - Zynq-7000 SoC, 275K LC, 800MHz | AMD
The AMD (Xilinx) XC7Z035-2FFG676I is a Zynq-7000 All Programmable System-on-Chip (SoC) combining a dual-core ARM Cortex-A9 MPCore processing system running at 800 MHz with a Kintex-7 class FPGA fabric of 275K logic cells, housed in a 676-ball FCBGA (27x27 mm) industrial-grade package. A Zynq-7000 SoC is a class of programmable system-on-chip devices that integrate a hardwired processor system (PS) with programmable logic (PL) on a single die. Unlike a standalone FPGA or a standalone microprocessor, a SoC FPGA allows software running on the ARM cores and hardware accelerators in the fabric to communicate over high-bandwidth on-chip AXI interconnect, making the device family a cornerstone of modern embedded processing and adaptive computing hierarchies. Key features of the XC7Z035 include the mid-range 275K logic cell fabric, a -2 speed grade, and industrial temperature screening (the I suffix, typically -40C to +100C junction), making it suitable for harsh-environment deployments. The hard processor system offloads control-plane software while the fabric absorbs data-plane acceleration, math, and custom I/O. Architecturally, the device pairs the ARM Cortex-A9 NEON/FPU-enabled cores with CoreSight debug, caches, on-chip memory, and a rich set of PS peripherals, bonded to Kintex-7-based programmable logic with DSP slices, block RAM, and high-speed serial transceivers. AXI ports bridge the two domains with low latency. Typical applications include industrial automation and motor control, aerospace and defense processing, software-defined radio, video and image processing pipelines, and network packet processing where a soft processor would be too slow and a discrete CPU+FPGA pair too costly. When designing with this device, plan power sequencing between VCCINT, VCCAUX, and PS rails, and select a Vivado device name matching the industrial speed-grade variant to avoid implementation errors. This page synthesizes distributor pricing, verified same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
XC7Z045-1FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
The AMD XC7Z045-1FBG676I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processor with a Kintex-7 FPGA fabric. It is housed in a 676-pin FCBGA package (27x27 mm) and operates at a maximum clock frequency of 667 MHz. The device provides 350K logic cells, making it suitable for high-performance embedded applications requiring both software programmability and hardware flexibility. A System-on-Chip (SoC) is an integrated circuit that combines multiple system components, such as processors, memory interfaces, and I/O, onto a single substrate. The Zynq-7000 family specifically merges a processing system (PS) based on ARM cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement complex algorithms in hardware while maintaining the flexibility of software-defined control, bridging the gap between traditional microprocessors and FPGAs. Key features of the XC7Z045-1FBG676I include 350K logic cells, 256 KB of on-chip RAM, and support for high-speed transceivers. The device also includes a rich set of I/O options, including multiple high-speed serial transceivers and general-purpose I/O banks. The dual-core ARM Cortex-A9 processor runs at up to 667 MHz, providing substantial processing power for real-time applications. From a technical perspective, the XC7Z045-1FBG676I leverages AMD's advanced 28nm process technology, balancing performance and power efficiency. The integration of the ARM processor with the Kintex-7 FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, which is critical for applications like software-defined radio, image processing, and industrial control. The device supports a wide range of industry-standard interfaces, including DDR3/DDR4 memory controllers and PCIe. Typical applications include high-end embedded computing, aerospace and defense systems, medical imaging, and wired/wireless communications. The combination of a powerful processor and reconfigurable logic makes it ideal for prototyping and production in demanding environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to avoid latch-up or damage. Additionally, the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.
XC7Z045-1FFG900I - Zynq-7000 SoC, 350K Logic Cells | AMD
The AMD XC7Z045-1FFG900I is a Zynq-7000 SoC that integrates a dual-core ARM Cortex-A9 MPCore processing system (PS) with a 28nm Kintex-7-class programmable logic (PL) fabric in a single device. It is housed in a 900-ball FCBGA package (31x31 mm) and operates at a maximum PS clock frequency of 667 MHz. This SoC provides 350K logic cells, making it a high-capacity platform for embedded systems that require both software flexibility and hardware acceleration. A System-on-Chip (SoC) FPGA combines a hard processor subsystem with programmable logic on one die. The Zynq-7000 family, introduced by Xilinx (now AMD) in 2012, is a leading example of this architecture. It allows designers to implement complex systems where the ARM cores handle control and communication tasks, while the FPGA fabric accelerates data-intensive algorithms. This integration reduces board space, power, and latency compared to discrete processor-plus-FPGA designs. Key features of the XC7Z045-1FFG900I include 350K logic cells, 667 MHz dual-core ARM Cortex-A9 processing, and a 900-ball FCBGA package. The device supports a wide range of I/O standards and includes high-speed serial transceivers. The 'I' suffix indicates an industrial temperature grade, suitable for harsh environments. The '1' speed grade offers a balance between performance and power consumption. The Zynq-7000 architecture provides a high-bandwidth connection between the PS and PL through AXI interfaces, enabling efficient data movement. The PL is based on the 7-series FPGA fabric, which includes configurable logic blocks, block RAM, and DSP slices. This allows for the implementation of custom accelerators, soft processors, and high-speed I/O interfaces. The PS includes memory controllers for DDR3/DDR3L, as well as a rich set of peripherals such as Gigabit Ethernet, USB, and SPI. Typical applications for the XC7Z045-1FFG900I include software-defined radio, industrial motor control, medical imaging, and aerospace and defense systems. Its combination of processing power and programmable logic makes it ideal for applications requiring real-time signal processing, high-speed data acquisition, and flexible I/O. The industrial temperature grade ensures reliable operation in demanding environments. When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails, and proper sequencing is critical to prevent damage. Additionally, the high-density BGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals. AMD provides comprehensive reference designs and documentation to assist with these challenges.
XC7Z045-2FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
The AMD XC7Z045-2FBG676I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including software-defined radio, industrial motor control, and high-performance video processing. The XC7Z045-2FBG676I features 350K logic cells, 800MHz maximum processor clock speed, and is housed in a 676-ball FCBGA (27x27mm) package. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. It typically includes a processor core, memory, input/output ports, and secondary storage interfaces. In the context of the Zynq-7000 family, the SoC combines a hard processing system (PS) based on ARM Cortex-A9 cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement custom hardware accelerators in the PL while running operating systems like Linux on the PS, offering a balance of performance, flexibility, and power efficiency. Key features of the XC7Z045-2FBG676I include 350K logic cells, 800MHz dual-core ARM Cortex-A9 processor, 16.25 Mb of block RAM, and 900 DSP slices. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The -2 speed grade indicates a high-performance variant, suitable for demanding applications. The industrial temperature grade (I suffix) allows operation from -40°C to +100°C, making it suitable for harsh environments. The Zynq-7000 architecture provides a unique advantage by enabling tight coupling between the processing system and programmable logic through an AMBA AXI interconnect. This allows for high-bandwidth, low-latency communication between software running on the ARM cores and custom hardware logic. The device also includes a memory management unit, DDR3/DDR3L memory controller, and various peripheral interfaces such as USB, Gigabit Ethernet, and SDIO, enabling a complete embedded system on a single chip. Typical applications for the XC7Z045-2FBG676I include software-defined radio, where the programmable logic handles baseband processing while the ARM cores run protocol stacks; industrial motor control, where custom PWM and encoder interfaces are implemented in logic; and high-performance video processing, where the PL accelerates image processing algorithms. The device is also used in aerospace and defense applications requiring high reliability and long-term availability. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a heatsink for high-power applications. The device supports multiple power rails (VCCINT, VCCAUX, VCCO) that must be sequenced correctly during power-up to prevent damage.
XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD
The AMD/Xilinx XC7Z100-2FFG900I is a Zynq-7000 All Programmable System-on-Chip (AP SoC) that integrates a dual-core ARM Cortex-A9 MPCore processor (up to 800 MHz) with a Kintex-7 FPGA fabric (444K logic cells, 26.5 Mb block RAM, 1540 DSP slices) in a single 900-ball FCBGA package (31x31 mm). It combines software programmability with hardware programmability, enabling hardware acceleration of compute-intensive workloads. A Zynq-7000 SoC is a heterogeneous multiprocessor device that fuses a Processing System (PS) - a dual ARM Cortex-A9 with NEON SIMD engines, caches, MMU, and standard peripherals - with Programmable Logic (PL) equivalent to a Kintex-7 FPGA. The PS boots first and configures the PL at start-up, allowing software designers to use familiar Cortex-A9 toolchains (GCC, Linux, FreeRTOS) while hardware designers accelerate critical paths in the PL. The XC7Z100 sits at the top of the Zynq-7000 family, sharing the Kintex-7 fabric with the Z-7045 but adding extra logic, DSP, and block RAM resources. Key features include 2x ARM Cortex-A9 cores at up to 800 MHz, 444K logic cells, 26.5 Mb block RAM, 1540 DSP48E1 slices, 16 GTX transceivers at up to 6.25 Gb/s, dual 12-bit 1 MSPS ADCs (XADC), 4x PCIe Gen2 hard blocks, and 2x USB 2.0 OTG ports. The integrated CoreSight debug enables multicore trace, and security features include AES, SHA, and RSA hardware accelerators alongside secure boot. Typical applications include high-performance embedded vision (machine-learning inference, ADAS front cameras), 8K video processing, software-defined radio baseband, industrial motor control with deterministic real-time loops, and avionics/medical imaging. The Kintex-7 PL is well suited to DSP-heavy algorithms like FFT, LDPC, and H.265 codec blocks. When designing, allocate decoupling and bulk capacitors close to each power rail (VCCPINT, VCCPAUX, VCCO, VCCAUX, MGTAVCC); use the AMD-recommended power-on/-off sequencing; and adopt the UG865 ASCII package files when laying out the 900-ball FCBGA. For evaluation, the ZC706 board (XC7Z045 in FFG900) is pin-compatible with the XC7Z100 FFG900 footprint, which AMD documents as an authorized Z-7100 reference platform.
XC95144XL-10TQG100C - 3.3V 144-Macrocell CPLD | AMD
The AMD XC95144XL-10TQG100C is a 3.3 V in-system-programmable CPLD with 144 macrocells, 81 I/Os, 3,200 usable gates, 5 ns pin-to-pin logic delays, and a system frequency up to 178 MHz, housed in a 100-pin TQFP package. It is designed for high-performance, low-voltage logic integration in communications and computing systems. A CPLD, or complex programmable logic device, is a programmable semiconductor that combines reconfigurable logic fabric with nonvolatile Flash memory. It sits between simple fixed-function gates and larger FPGAs in the broader semiconductor hierarchy, providing deterministic timing, flexible logic integration, and in-system programming. The XC95144XL family uses eight 54V18 function blocks and is intended for designs requiring multiple logic functions without the complexity of a full FPGA. Key features include 144 macrocells, 81 user I/Os, 3,200 usable gates, and a 10 ns speed designation in the manufacturer part number. The supplied device data identifies a 5 ns pin-to-pin logic delay and system frequency up to 178 MHz. Its in-system programmability supports configuration updates without removing the device from the circuit, while Flash configuration storage preserves the programmed logic after power removal. The TQFP-100 package provides a surface-mount form factor for compact PCB designs. The XC95144XL architecture is organized around eight 54V18 function blocks, enabling general-purpose logic integration for communications, computing, control, and interface designs. The 3.3 V operating class and low-voltage architecture align with modern digital systems, but system designers must still verify supply tolerances, I/O standards, timing constraints, and power sequencing against the manufacturer datasheet before releasing a PCB. Typical applications include communications equipment, computing systems, industrial control logic, peripheral interfacing, signal conditioning, glue logic, and board-level control functions. The 81 I/O count provides connectivity for external buses, status signals, control lines, and programmable logic blocks. For designs requiring more I/O or higher logic density, the related XC95144XL-10TQG144I uses a different 144-pin package and should not be treated as a pin-compatible replacement. The primary design consideration is package and pinout verification. XC95144XL-10TQG100C and XC95144XL-10TQG144I are not interchangeable on a PCB because their packages and I/O counts differ. Programming must follow the AMD/Xilinx device programming procedure, and unused pins, power pins, ground pins, and configuration pins must be connected exactly as specified by the manufacturer datasheet. This page combines verified manufacturer and distributor information with practical CPLD application guidance, package-selection context, and verified cross-reference limitations. It is intended to help engineers identify the correct XC95144XL device, locate its datasheet, and distinguish true drop-in alternatives from different-package options.
XC9572XL - 3.3V 72-Macrocell CPLD 5ns | Xilinx AMD
The Xilinx (now AMD) XC9572XL is a 3.3V high-performance CPLD (Complex Programmable Logic Device) providing 1,600 usable gates, 72 macrocells, and a worst-case pin-to-pin propagation delay of 5 ns, housed in low-profile VQFP packages such as the 44-pin VQ44 and 64-pin VQ64. A CPLD is a type of programmable logic device that sits between simple PLDs and FPGAs in the programmable logic hierarchy. Unlike FPGAs, which use look-up tables and volatile configuration memory, CPLDs use macrocell-based sum-of-products architecture with nonvolatile program storage, delivering deterministic, pin-to-pin timing and instant-on operation at power-up. This makes CPLDs the workhorse choice for glue logic, bus interfacing, and power-sequencing control in embedded systems. The XC9572XL is comprised of four 54V18 Function Blocks, each containing 18 macrocells. Key features include 3.3V core operation targeted at high-performance, low-voltage applications in leading-edge communications and computing systems; industry-leading pin-locking capability through a switch matrix that routes flexibly; and multiple speed grades (-5, -7, -10) so designers can trade speed against cost. Individual output enables and slew-rate-limited outputs ease 3.3V bus interfacing. Architecturally, every macrocell is a registered or combinational function generator with product-term allocation, allowing dense state machines without wasting resources. Because configuration is stored in nonvolatile memory across the XC9500XL family, no external boot flash or configuration controller is required, simplifying BOM and board design compared with SRAM-based FPGAs. Typical applications include address decoding and glue logic in embedded processors, bus bridging and interfacing in communications equipment, power-up reset and sequencing control, industrial I/O expansion, and legacy system life-cycle extensions where deterministic timing matters. Design-wise, use the -5 speed grade only where the 5 ns timing is genuinely needed; the -10 grade offers the best value for most glue-logic tasks. Note that design entry requires the legacy Xilinx ISE toolchain, which no longer runs natively on modern Windows. This page synthesizes distributor pricing, drop-in alternatives across speed grades and packages, and practical design notes not found in the manufacturer datasheet DS057.
XC9572XL-10VQG64C - 72-Macrocell 10ns CPLD | AMD/Xilinx
The AMD/Xilinx XC9572XL-10VQG64C is a 3.3V, 10ns pin-to-pin delay, 72-macrocell high-performance CPLD housed in a 64-pin VQFP (VQG64) package. It is built on the 2.5V XC9500XL family architecture, providing four 54V18 Function Blocks (FBs) that deliver 1,600 usable gates with predictable, JTAG-programmable logic and 100,000 program/erase cycles endurance. The device targets glue-logic and bus-interface functions where deterministic timing and instant-on (in-system programmable via IEEE 1149.1 JTAG) replace discrete 74-series logic. A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device whose architecture is a sea of macrocells backed by a programmable interconnect matrix. In the system hierarchy, a CPLD sits below an FPGA (typically lower density but lower power and no configuration time) and above discrete SSI/MSI gates. CPLDs are routinely used as interface bridges, address decoders, state machines, and power-up sequencers in designs that need predictable timing in a single device. Key features of the XC9572XL-10VQG64C include 72 macrocells, 1,600 usable gates, 4 ns internal timing with 10 ns pin-to-pin (tPD) at 3.3V, 34 user I/O pins (64-pin VQFP), 5V-tolerant I/O with 3.3V core, and In-System Programmable (ISP) via JTAG. The XC9500XL family uses 5V tolerant I/O on a 3.3V core for mixed-voltage board designs. The device is specified over the commercial 0C to +70C ambient range (C suffix), with an industrial -40C to +85C option available as XC9572XL-10VQG64I. Architecturally, each Function Block contains 18 macrocells, 54 product terms, and a sum term allocated from a global pool, with the IEEE 1149.1 boundary-scan chain extending across all I/O pins. Per datasheet DS057, the Fast CONNECT switch matrix provides 100% connectivity to every FB output, enabling deterministic place-and-route timing. The I/O blocks support 5V tolerant inputs, 24 mA drive, slew-rate control, and per-pin user I/O standards. Typical applications include bus-interface bridging, address decoding, power-up logic sequencing, and I/O expansion in telecom line cards, industrial controllers, and embedded computing platforms. Because of its 5V tolerant I/O on a 3.3V core, the XC9572XL-10VQG64C is well suited to legacy systems that mix 5V peripherals with 3.3V ASICs. Designers also use it as an FPGA configuration PROM companion or as a power-sequencer for multi-rail designs. When designing with this part, ensure the JTAG TMS, TCK, TDI, and TDO pins are reserved and pulled appropriately, and provide a clean VCCAUX 3.3V rail because all outputs are powered from VCCIO while the core runs from VCCINT. Verify pin-compatibility across the family when migrating density, since the XC9536XL, XC9572XL, and XC95144XL share a footprint family plan across the 44-, 64-, and 100-pin VQFP/TQFP packages. This page synthesizes distributor stock and lead-time data, pin-compatible XC9500XL alternatives, and practical glue-logic design notes not found in the manufacturer datasheet alone.
XCKU035-1FBVA676C Kintex UltraScale FPGA 444K Cells | AMD
The AMD Xilinx XCKU035-1FBVA676C is a Kintex UltraScale Field Programmable Gate Array built on TSMC's 20nm process, integrating 444,343 logic cells and 19,456,000 system gates in a 676-ball FCBGA package (27 mm × 27 mm) with 312 user I/Os. It runs a -1 speed grade targeting up to 630 MHz fabric performance, with 12.5 Gb/s capable transceivers (GTH) on select Kintex UltraScale SKUs and 240 DSP48E2 slices optimized for high-throughput fixed- and floating-point arithmetic. The commercial temperature grade (suffix C) supports 0 °C to +85 °C operation with a 0.95 V core voltage. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement custom digital circuits after PCB fabrication by configuring an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, and high-speed serial transceivers. Within the broader semiconductor hierarchy, an FPGA sits between general-purpose CPUs/GPUs (fixed instruction set, software-defined) and ASICs (fixed hardware). AMD's Kintex UltraScale family occupies the mid-range position in the UltraScale portfolio, sitting below Virtex UltraScale (highest logic density and bandwidth) and above Artix UltraScale (lowest cost and power). All Xilinx boards shift the value curve toward best-in-class price/performance/watt at 20nm. Key features of the XCKU035-1FBVA676C include up to 1,250 Mbps of DDR4 external memory interface support, integrated PCIe Gen3 hard cores, 4.7 Mb of distributed RAM, 240 DSP slices, and 16 GT transceivers on -1 speed grade parts in the larger Kintex UltraScale family. The device provides 312 high-performance SelectIO pins supporting multiple I/O standards including LVDS, HSTL, SSTL, and differential memory interfaces. The device also exposes 3 MMCM and 8 PLL mixed-mode clock managers for high-frequency clock synthesis and skew management. Architecturally, the Kintex UltraScale device uses UltraScale architecture enhancements over 7-series FPGAs - including new routing interconnect, more efficient clock networks, and improved block RAM and DSP resources. The 20nm planar CMOS process allows higher integration while keeping leakage power low, and the GT(GTH) transceivers support 12.5 Gb/s line rates for backplane and chip-to-chip serial interconnect. The XCKU035-1FBVA676C serves wireless baseband processing, software defined radio, high-definition video processing pipelines, high-speed serial backplane bridging, and PCIe accelerator card designs in the 100K–500K logic-cell density class. When laying out a board with this BGA, allocate 12 power rails (VCCINT, VCCAUX, VCCO, MGTAVCC, MGTAVTT, VBATT, MGTVCCAUX, VCCADC, VCCBRAM, VCCO_HP, VCCAUX_IO, plus GT helper rails) and follow the package-specific K7-PCB decaps guidance in UG583 to control simultaneous switching noise and SSN.
XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD
The AMD (formerly Xilinx) XCKU035-2FBVA676E is a Kintex UltraScale field-programmable gate array (FPGA) IC delivering 355,474 logic cells (194,560 6-input LUTs), 19.45M total on-chip memory bits, and 312 user I/Os, fabricated in a 20 nm CMOS process and housed in a 676-ball flip-chip BGA (FCBGA-676) package. It is a logic-density mid-range device in the Kintex UltraScale family and is targeted at high-throughput DSP, 100G packet processing, and ASIC-prototyping workloads. The "-2" suffix denotes the -2 speed grade (the second-fastest bin in the family), and the "E" suffix denotes the extended (industrial) temperature screening of -40 C to +100 C. A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping. Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking. Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks. Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards. When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade. This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.
XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD
The AMD XCKU035-2FBVA676I is a Kintex UltraScale Field Programmable Gate Array (FPGA) with 444,343 logic cells and 19,456,000 bits of block RAM, housed in a 676-ball Flip-Chip BGA package. Built on a 20nm process node and offered at a -2 (mid) speed grade, this device targets mid-range high-performance applications requiring an optimal balance of price, performance, and power efficiency. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed post-manufacture to implement arbitrary digital functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically under digital semiconductors and ICs. The Kintex UltraScale family from AMD (formerly Xilinx) addresses the spectrum between cost-optimized Artix and high-end Virtex devices, focusing on DSP, memory bandwidth, and transceiver integration. Key features of the XCKU035 include 312 maximum user I/Os, integrated DSP slices for high-throughput signal processing, dedicated block RAM (BRAM) for on-chip data storage, and high-speed serial transceivers suitable for chip-to-chip and backplane links. The device supports multiple configuration modes including JTAG, SPI, and BPI, enabling flexible boot strategies in production systems. The Kintex UltraScale architecture leverages a 20nm planar process with stacked-silicon interconnect (SSI) options in larger family members. The XCKU035 uses monolithic silicon, providing predictable performance and lower cost. The UltraScale architecture introduces enhanced routing, multi-die clocking, and improved DSP and BRAM utilization rates over prior 7-Series FPGAs. Typical applications of the XCKU035-2FBVA676I include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, video broadcast equipment, industrial machine vision, 100G network interface cards, and aerospace telemetry. Its combination of logic density, memory bandwidth, and transceivers makes it well-suited for prototyping ASICs or low-volume production. When designing with the FBVA676 BGA, plan for high-density PCB fabrication with microvia or via-in-pad stackups, controlled-impedance traces for transceivers, and robust power distribution with high-frequency decoupling to satisfy simultaneous switching noise (SSN) requirements. This page synthesizes distributor pricing, FPGA drop-in alternatives within the same 676-BGA footprint, and practical design notes not typically presented in the manufacturer datasheet.
XCKU040-2FFVA1156I - Kintex UltraScale FPGA 520 I/O | AMD
The AMD XCKU040-2FFVA1156I is a Kintex UltraScale FPGA with 520 user I/O, 21,606,000 system logic capacity, 530,250 DSP-equivalent resource units, speed grade -2, in a 1156-ball FCBGA package rated for industrial temperatures of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), DSP slices, block RAM, and programmable interconnect that designers configure after manufacturing. Within the power-management hierarchy of digital system ICs, an FPGA sits at the top of the programmable logic taxonomy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA. FPGAs are used where custom logic, parallelism, or post-deployment reconfigurability is required that fixed-function ASICs or microcontrollers cannot provide. Key features of the XCKU040-2FFVA1156I include the 20nm UltraScale architecture, which lowers total power consumption versus the previous 28nm 7-series generation, a -2 speed grade for high-performance designs, and an industrial (I-suffix) temperature rating of -40C to +100C. The 1156-ball flip-chip BGA provides 520 user I/O for high-bandwidth parallel interfaces, and the fabric includes MMCM and PLL clock management resources. On the technical side, the Kintex UltraScale family focuses on price/performance using monolithic 20nm die. The device core supply operates from 0.922V to 0.979V per the datasheet listing. The UltraScale architecture adds enhanced routing, higher DSP throughput, and improved clocking compared to Kintex-7, making the XCKU040 a popular mid-density choice between the XCKU035 and XCKU060. Typical applications include industrial image processing and machine vision, wireless baseband and RF front-end processing, medical ultrasound, and ASIC prototyping. The 520 I/O count suits multi-camera sensor aggregation and high-width data converters. Design consideration: FCBGA-1156 devices require careful PCB stackup design - escape routing under the 1.0mm ball pitch typically needs via-in-pad or at least 8 layers, and core voltage rails must meet the tight 0.922-0.979V tolerance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD
The AMD Xilinx XCKU3P-1FFVB676E is a Kintex UltraScale+ field-programmable gate array (FPGA) offering 355,950 logic cells, 31,641,600 bits of block RAM, and 1,560 DSP slices, housed in a 676-ball FCBGA package (FFVB676) at the -1 speed grade and the E (extended) temperature tier. It integrates 280 user I/O pins and 24 transceivers supporting up to 16.375 Gbps, making it the mid-density workhorse of the Kintex UltraScale+ family. Kintex UltraScale+ FPGAs occupy a specific tier in AMD's programmable-logic taxonomy: below Virtex UltraScale+ for highest performance and above Artix-7/Artix UltraScale+ for cost-optimized applications. Architecturally, the UltraScale+ generation introduces a register-rich silicon fabric, 3rd-generation SSI (stacked silicon interconnect) techniques, and tightly coupled DSP/BRAM columns, delivering up to 2x the performance-per-watt versus the prior generation for DSP-intensive workloads such as 5G baseband, machine-learning inference, and high-speed instrumentation. Key features of the XCKU3P include 16.375 Gbps GTH transceivers (24 channels), 6.6 Tbps serial bandwidth per device, integrated 100G Ethernet MACs, and a system-monitoring block that tracks on-die voltage and temperature. The device supports DDR4-2400 with on-chip ECC and offers hardware-rooted security via bitstream encryption and authentication using AES-256 and RSA-2048. The 676-ball FCBGA package has a body size of 27 mm × 27 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs using standard BGA assembly. Typical applications span high-performance digital signal processing, 100G Ethernet network interface cards, 4K/8K video processing pipelines, test and measurement instrumentation, software-defined radio (SDR), and radar/EW front-end processing. The combination of high-speed transceivers and abundant DSP resources makes it a strong fit for low-latency, line-rate processing in both wired and wireless infrastructure. When designing with the XCKU3P-1FFVB676E, allocate at least eight PCB layers with continuous GND planes and matched-length pairs for transceivers; the package's 1.0 mm pitch requires HDI stack-ups (microvias). The extended (E) temperature grade supports -40 °C to +100 °C junction, and designers must respect the 2.0 W/cm² package thermal envelope with adequate airflow or heatsinking for sustained workloads. Vivado Design Suite is required for implementation.
XCKU5P-2FFVB676I - Kintex UltraScale+ FPGA 474K LC | AMD
The AMD XCKU5P-2FFVB676I is a Kintex UltraScale+ Field Programmable Gate Array (FPGA) with 474,600 logic cells, 280 user I/Os, and 41,984,000 bits of block RAM, housed in a 676-ball FCBGA (FFVB676) package rated for the industrial temperature range. An FPGA is an integrated circuit that designers configure after manufacturing - hence field-programmable. FPGAs sit within the programmable logic device (PLD) family alongside CPLDs and form the heart of modern adaptive computing systems, providing arrays of programmable logic blocks, routing fabric, and I/O banks that enable highly parallel hardware acceleration. They are frequently used where ASIC cost or inflexibility cannot be justified. Key features of the XCKU5P include support for 725 MHz internal clocking, MMCM and PLL clock-management tiles, and core operation from 825 mV to 876 mV. The -2 speed grade balances maximum fabric performance against dynamic power, and the industrial rating (-40C to +100C junction) suits harsh deployments. Technically, the Kintex UltraScale+ family is built on a 16nm FinFET process delivering approximately 1.5x better performance-per-watt than the previous 20nm UltraScale generation. The device integrates high-speed serial transceivers, PCIe Gen3/4 hard blocks, and 100G Ethernet MAC capability, supporting high-bandwidth connectivity and partial reconfiguration for dynamic logic updates without system power-down. Typical applications include wired and wireless communications infrastructure, data center acceleration, video and image processing, and aerospace and defense systems where logic density plus low power are decisive. Designers should pay careful attention to power integrity: the 0.85 V typical core rail demands a clean, low-noise supply with dedicated power planes and extensive decoupling, and thermal dissipation under high utilization must be budgeted via the FCBGA thermal path. This page synthesizes distributor pricing, verified drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet alone.
XCVU9P-2FLGA2104I - Virtex UltraScale+ FPGA | AMD/Xilinx
The AMD XCVU9P-2FLGA2104I is a Virtex UltraScale+ FPGA delivering 416 user I/O, 3,911,680 Kb of block RAM capacity and 2,586,150 CLB flip-flops in a 2104-ball FCBGA (FLGA2104) package, with the -2I industrial speed grade rated for -40C to +100C operation. It targets high-performance digital designs that need massive parallel processing, on-chip memory, and high-speed serial connectivity. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, memory, and interconnect are programmed after manufacturing. Within the semiconductor hierarchy, FPGAs sit alongside ASICs and ASSPs as core system logic devices, and the Virtex UltraScale+ family is AMD Xilinx's flagship programmable logic line for leading-edge compute, networking, and aerospace systems. Key features include the 16nm FinFET UltraScale+ fabric, the -2 speed grade optimized for high clock frequencies, and 416 package I/O for wide external buses. The device's block RAM and UltraRAM resources (up to 270 Mb UltraRAM cited in application literature) support deep buffering for packet processing and machine learning pipelines. Architecturally, the Virtex UltraScale+ family combines CLB logic, DSP48E2 slices, block RAM, UltraRAM, and GTY multi-gigabit transceivers (52 package GTY channels cited for this device) on a single die, enabling deterministic, low-latency implementations such as hardware trading paths and 5G fronthaul. The 2104-ball FCBGA packaging provides the power and signal integrity required at these data rates. Typical applications include 5G wireless baseband, data center acceleration, AI inference, and low-latency financial trading, all of which exploit the fabric's parallelism and transceiver bandwidth. Industrial and aerospace systems also use the -I industrial temperature variant for extended thermal environments. Design consideration: plan power distribution and decoupling for the multiple VCCINT/VCCO rails early, and use AMD Xilinx Vivado for synthesis and implementation - the -2I speed grade files are required for correct timing closure. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
XCZU11EG-2FFVF1517I - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU11EG-2FFVF1517I is a Zynq® UltraScale+™ MPSoC EG device integrating a Quad ARM® Cortex®-A53 MPCore™ processor system with a Dual ARM® Cortex®-R5 real-time processor, an ARM Mali™-400 MP2 graphics processing unit, and a large programmable FPGA fabric in a 1517-ball FCBGA (40x40 mm) package. The -2 speed grade and industrial temperature grade (I) make it suitable for high-performance embedded applications requiring both hardware flexibility and software agility. A System-on-Chip FPGA (SoC FPGA) combines a hard processor subsystem (PS) with programmable logic (PL) on a single die. This architecture enables designers to implement custom hardware accelerators, high-speed I/O interfaces, and real-time control functions in the PL while running an operating system such as Linux or VxWorks on the ARM cores in the PS. The Zynq UltraScale+ family sits at the high end of this hierarchy, offering advanced DSP engines, high-bandwidth DDR memory interfaces, and multi-gigabit transceivers that go beyond conventional FPGA or microcontroller solutions. Key features of XCZU11EG-2FFVF1517I include 653,100 programmable logic cells, 597,120 FPGA registers, and 22,124,954 bits of block RAM. The PS supports a 1.3 GHz maximum ARM Cortex-A53 clock, a 600 MHz Cortex-R5 clock, and a 533 MHz Mali-400 MP2 clock. Connectivity interfaces include CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, allowing direct interface to a wide range of peripheral devices and system networks. The MPSoC is built on TSMC 16nm FinFET technology, enabling high logic density with manageable power dissipation. The -2 speed grade provides balanced timing performance for the programmable fabric, while the industrial temperature grade supports operation in demanding -40°C to +100°C environments. The 1517-ball FCBGA package with 40x40 mm body and 0.8 mm ball pitch enables high-density PCB routing for complex multi-rail power and high-speed serial links. Typical applications include edge AI inference at industrial sites, 5G/4G baseband processing, radar and electronic warfare systems, broadcast and professional AV equipment, medical imaging, and data center SmartNICs. Designers should note that the device requires multiple power rails (VCCINT, VCCAUX, VCCBRAM, VCCO, PS rails) and careful sequencing; the recommended power-up sequence can be found in PG201 (Zynq UltraScale+ PCB Design). Adequate decoupling capacitors and a solid power delivery network are critical to achieving reliable high-speed operation. When designing with this MPSoC, ensure that the boot mode pins are correctly configured for the desired QSPI, SD, or JTAG boot source. The PS can offload complex control tasks, while the PL implements latency-sensitive data path acceleration. Thermal management must consider both the PS and PL power consumption, and a heatsink or airflow is recommended for sustained high utilization.
XCZU11EG-3FFVF1517E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU11EG-3FFVF1517E is a Zynq UltraScale+ MPSoC EG device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with UltraScale+ programmable logic. This System-on-Chip (SoC) is housed in a 1517-pin FCBGA package (40x40 mm) and supports 464 user I/O pins. The device operates with a maximum logic cell count of 653K+ and features processor speeds of 600 MHz (Cortex-R5), 667 MHz (Mali-400), and 1.5 GHz (Cortex-A53). A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) fabric on a single die. This architecture enables designers to implement complex algorithms in hardware for high throughput while maintaining software flexibility for control and interface tasks. The EG variant targets embedded applications requiring a balance of compute performance and programmable logic density. Key features include the 653K+ logic cells, 464 I/O pins, and the high-performance 1.5 GHz Cortex-A53 cluster. The device supports a wide range of high-speed serial transceivers and memory interfaces, making it suitable for data-intensive applications. The -3 speed grade indicates the highest performance tier for this package, enabling maximum clock frequencies and throughput. The XCZU11EG-3FFVF1517E leverages TSMC's 16nm FinFET process technology, providing excellent power efficiency and performance. The UltraScale+ architecture includes advanced clocking resources, DSP slices, and block RAM, enabling efficient implementation of signal processing and AI inference workloads. The integrated ARM cores handle operating systems and application software, while the PL accelerates custom logic. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-end industrial automation. The device's combination of processing power and programmable logic makes it ideal for edge computing platforms that require real-time processing and flexible I/O. The 1517-FCBGA package supports dense PCB routing and high-speed signal integrity. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, and PS rails) require proper filtering and sequencing to ensure reliable operation. The device also requires a configuration source, such as QSPI flash or SD card, for booting the processing system.
XCZU15EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU15EG-1FFVB1156E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) combines the flexibility of an FPGA with the performance of a multi-core processor, targeting high-end embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that merges a processing system (PS) with programmable logic (PL) on a single die. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware. Key features include 747K+ logic cells, 328 user I/O pins, and a 1156-FCBGA (35x35 mm) package. The device operates with a nominal core voltage of 0.85V (range 0.825V to 0.876V) and supports clock speeds of 500MHz (Cortex-R5), 600MHz (Cortex-A53), and 1.2GHz (Mali-400). The '1' speed grade indicates standard performance, while the 'E' suffix denotes an extended temperature range of 0°C to +100°C. The XCZU15EG-1FFVB1156E is built on TSMC's 20nm technology, offering a balance of logic density, power efficiency, and performance. The device includes 256KB of on-chip RAM, a rich set of peripherals, and high-speed transceivers for connectivity. Its architecture supports hardware acceleration, real-time control, and advanced graphics, making it suitable for compute-intensive tasks. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and industrial automation. The combination of ARM cores and FPGA fabric allows for flexible, high-performance designs that can adapt to evolving requirements. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power sequencing requirements must be followed to ensure reliable operation.
XCZU15EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU15EG-2FFVB1156I is a Zynq UltraScale+ MPSoC EG device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a 16nm FinFET+ programmable logic fabric. This System-on-Chip (SoC) is housed in a 1156-ball FCBGA package measuring 35x35 mm, offering 747K+ logic cells and supporting processor speeds of 533 MHz (Cortex-A53), 600 MHz (Cortex-R5), and 1.3 GHz (Mali-400 MP2). A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die, enabling software-defined hardware acceleration. This device family sits within the broader hierarchy of adaptive SoCs, which bridge the gap between traditional microprocessors and reconfigurable logic. The EG variant specifically targets embedded applications requiring a balance of processing performance and programmable logic density. Key features of the XCZU15EG-2FFVB1156I include 747K+ logic cells, 32 Mb of block RAM, and 1,152 DSP slices for high-throughput signal processing. The device supports DDR4, LPDDR4, and 32-bit/64-bit memory interfaces, along with high-speed transceivers for serial connectivity. The -2 speed grade provides a balance between performance and power consumption, making it suitable for mid-range embedded systems. Architecturally, the device leverages AMD's UltraScale+ architecture with 16nm FinFET+ technology, delivering up to 1.5x performance-per-watt improvement over previous generations. The integrated ARM processors run a full operating system like Linux, while the programmable logic handles real-time, low-latency tasks. This heterogeneous approach enables system designers to partition workloads optimally between software and hardware. Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace/defense systems. The device's combination of high-speed serial transceivers, DSP resources, and multi-core processing makes it ideal for edge computing platforms that require both flexibility and performance. When designing with this device, careful attention must be paid to power supply sequencing and thermal management. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes to ensure signal integrity and heat dissipation.
XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU19EG-1FFVC1760E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with UltraScale+ programmable logic. It is housed in a 1760-FCBGA package (42.5x42.5 mm) and operates over a 0°C to 100°C junction temperature range. A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric. Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces. Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features. Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control. When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.
XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD
The AMD XCZU19EG-2FFVB1517I is a Zynq UltraScale+ MPSoC EG system-on-chip (SoC) in a 1517-FCBGA (40x40 mm) package. It integrates quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, an ARM Mali-400 MP2 graphics processor, and 1,143K+ FPGA logic cells. Its processing subsystem supports clock frequencies of 533 MHz, 600 MHz, and 1.3 GHz, enabling compute-intensive embedded applications in a single device. An MPSoC is a multi-processor system-on-chip that combines a processor system (PS) with programmable logic (PL) fabric, allowing designers to integrate software-based control and hardware-accelerated datapaths on one die. Within the programmable-logic hierarchy, the Zynq UltraScale+ MPSoC sits above traditional FPGAs by adding hardened ARM cores, memory controllers, and high-speed transceivers. This class of device is commonly used in 5G wireless, aerospace, defense, medical imaging, and data center acceleration. Key features of the XCZU19EG-2FFVB1517I include high logic density with 1,143K+ logic cells, a -2 speed grade for balanced performance, and industrial temperature grade (I suffix) for extended environmental operation. The 1517-FCBGA package exposes 16 accessible GTH transceivers; the device contains 72 total transceivers, but the D1760 package is required to access all GTY channels. The quad A53 cluster can run Linux, while the dual R5 cores handle deterministic real-time control. From a technical depth perspective, the Zynq UltraScale+ architecture uses 16nm FinFET process technology. The programmable logic can implement complex DSP pipelines, AI inference engines, and custom protocol bridges. The hardened PS includes DDR4 memory controllers, but the exact DDR4 PHY configuration and I/O bank assignments must be verified in the AMD package pinout file. The Mali-400 MP2 GPU accelerates lightweight graphics or compute-display tasks. Typical applications include 5G/6G radio and fronthaul processing, radar and electronic warfare subsystems, medical imaging and ultrasound beamforming, industrial machine vision, SmartNIC acceleration, and multi-channel video surveillance. The combination of hardened processors and scalable logic gives designers flexibility to partition functions between software and hardware. When designing with this device, plan a proper multi-rail power sequence and a robust thermal solution. Because exact VCCINT/VCCAUX voltage levels and thermal data are not included in the verified web snippets, refer to the official AMD Zynq UltraScale+ MPSoC data sheets and package pinout files before final board design.
XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU19EG-2FFVC1760E is a high-performance Zynq UltraScale+ MPSoC EG family system-on-chip (SoC) that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a large programmable logic (FPGA) fabric. This device is housed in a 1760-ball FCBGA package measuring 42.5x42.5 mm and is designed for demanding embedded applications requiring both high-level operating system support and real-time, low-latency processing. A Zynq UltraScale+ MPSoC is a heterogeneous multi-processor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single die. The PS typically includes application processors (Cortex-A53), real-time processors (Cortex-R5), and a graphics processor (Mali-400), while the PL is an FPGA fabric that can be configured to implement custom hardware accelerators, high-speed I/O interfaces, and complex digital logic. This architecture allows designers to optimize their systems by partitioning tasks between software running on the processors and hardware implemented in the FPGA. Key features of the XCZU19EG-2FFVC1760E include 1,143K+ logic cells in the programmable logic, providing substantial capacity for complex digital designs. The processing system operates at speeds of 533 MHz for the real-time processors, 600 MHz for the graphics processor, and 1.3 GHz for the application processors. The device supports 512 user I/O pins, enabling high-bandwidth connectivity to external memory, peripherals, and high-speed transceivers. From a technical perspective, the XCZU19EG-2FFVC1760E leverages AMD's UltraScale+ architecture, which is built on a 16nm FinFET process. This advanced process technology enables high performance and low power consumption compared to previous generations. The device includes a comprehensive set of hard intellectual property (IP) blocks, such as PCIe, USB, DisplayPort, and Gigabit Ethernet, which offload these functions from the programmable logic, freeing up resources for custom logic. Typical applications for the XCZU19EG-2FFVC1760E include high-end embedded computing, software-defined radio, medical imaging, aerospace and defense systems, and data center acceleration. Its combination of powerful processors and large FPGA fabric makes it suitable for applications that require both complex software algorithms and high-throughput, low-latency hardware processing. When designing with this device, careful attention must be paid to power supply sequencing, thermal management, and high-speed PCB layout. The device requires multiple power rails with specific voltage levels and sequencing requirements. Adequate decoupling and a robust power delivery network are essential for reliable operation at high clock speeds.
XCZU1CG-2SFVA625E - Zynq UltraScale+ SoC FPGA | AMD
The AMD XCZU1CG-2SFVA625E is a Zynq® UltraScale+™ MPSoC (Multi-Processor System-on-Chip) that integrates a dual-core ARM® Cortex®-A53 application processor and a dual-core ARM® Cortex®-R5 real-time processor with programmable logic fabric in a single 625-ball FCBGA package. This device is part of the Zynq UltraScale+ family, offering a balance of processing performance and FPGA flexibility for a wide range of embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a processing system (PS) with programmable logic (PL) on a single chip. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O interfaces, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware. Key features of the XCZU1CG-2SFVA625E include a maximum clock frequency of 1.333GHz for the Cortex-A53 cores and 533MHz for the Cortex-R5 cores, providing substantial processing power for demanding applications. The device is housed in a 625-FCBGA package with a 21x21mm footprint, offering a compact solution for space-constrained designs. The -2 speed grade indicates a mid-range performance level, balancing speed and power consumption. The XCZU1CG-2SFVA625E is built on TSMC's 16nm FinFET process technology, enabling high performance with low power consumption. The programmable logic fabric provides a rich set of resources including configurable logic blocks, block RAM, DSP slices, and high-speed transceivers, allowing for flexible hardware acceleration and custom I/O implementations. The device also includes a comprehensive set of hard IP blocks, such as PCIe, USB, and DisplayPort controllers, reducing the need for external components. Typical applications for this device include industrial automation, automotive driver assistance systems, medical imaging, and aerospace and defense systems. The combination of ARM processing and FPGA flexibility makes it ideal for applications requiring real-time processing, high-speed data acquisition, and custom I/O interfaces. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to ensure reliable operation, and the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.