XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
Teilenummer: XCZU19EG-1FFVC1760E ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1115.2 | $1.115,20 |
| 10 | $1050 | $10.500,00 |
| 100 | $980 | $98.000,00 |
| 500 | $920 | $460.000,00 |
| 1.000 | $870 | $870.000,00 |
XCZU19EG-1FFVC1760E Übersicht
A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric.
Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces.
Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features.
Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control.
When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.
Drop-in-Alternativen für XCZU19EG-1FFVC1760E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XCZU19EG-1FFVC1760E (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Processor Core, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XCZU19EG-2FFVC1760E
✅ Drop-In✓ Auf Lager
$6400 / Stück
Datenblatt ansehen →XCZU19EG-1FFVC1760I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU19EG-2FFVC1760I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU19EG-L2FFVD1760E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU19EG-1FFVD1760E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCZU19EG-1FFVC1760E Grenzwerte & elektrische Eigenschaften
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Clock Speed | 500MHz, 600MHz, 1.2GHz |
| Gehäuse | 1760-FCBGA (42.5x42.5 mm) |
| Betriebstemperatur | 0°C to 100°C (TJ) |
| Montageart | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1760 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Speed Grade | -1 |
XCZU19EG-1FFVC1760E Pin-Konfiguration
| Pin A1 | VCCINT — Core logic power supply |
| Pin A2 | GND — Ground |
| Pin B1 | VCCO_0 — I/O bank 0 power supply |
| Pin B2 | IO_L1P_T0 — Differential I/O pair |
| Pin C1 | IO_L1N_T0 — Differential I/O pair |
| Pin C2 | VCCAUX — Auxiliary power supply |
| Pin D1 | DDR4_DQ[0] — DDR4 data line |
| Pin D2 | DDR4_DQ[1] — DDR4 data line |
| Pin E1 | DDR4_DQS[0] — DDR4 data strobe |
| Pin E2 | DDR4_DM[0] — DDR4 data mask |
| Pin F1 | GTY_REFCLK0 — GTY transceiver reference clock |
| Pin F2 | GTY_TX0_P — GTY transceiver transmit positive |
Typische Anwendungen
XCZU19EG-1FFVC1760E ist geeignet für 6 Anwendungs: Aerospace and Defense Signal Processing, Automotive Driver Assistance Systems, Industrial Automation and Control, Data Center Acceleration, Medical Imaging and Diagnostics, Wireless Communication Infrastructure.
Aerospace and Defense Signal Processing
The XCZU19EG-1FFVC1760E excels in aerospace and defense applications requiring high-throughput signal processing. Its 1143K+ logic cells and quad-core Cortex-A53 enable real-time radar, sonar, and electronic warfare processing. The programmable logic accelerates FFT and beamforming algorithms, while the ARM cores handle system control and communication protocols. The 1760-FCBGA package supports high-density PCB designs for mission-critical systems.
Empfohlen
Automotive Driver Assistance Systems
In automotive ADAS applications, the XCZU19EG-1FFVC1760E provides the processing power for sensor fusion, object detection, and decision-making. The dual-core Cortex-R5 handles real-time control tasks, while the Cortex-A53 runs Linux-based applications. The programmable logic accelerates neural network inference and image processing. The device's 0°C to 100°C temperature range suits under-hood environments.
Empfohlen
Industrial Automation and Control
The XCZU19EG-1FFVC1760E is ideal for industrial automation, offering real-time control and flexible I/O. The dual-core Cortex-R5 provides deterministic response for motion control, while the programmable logic implements custom communication protocols like EtherCAT and PROFINET. The Mali-400 GPU supports HMI graphics. The device's robust design handles harsh industrial environments.
Empfohlen
Data Center Acceleration
For data center workloads, the XCZU19EG-1FFVC1760E provides hardware acceleration for networking, storage, and compute-intensive applications. The programmable logic implements custom packet processing and compression algorithms, while the ARM cores handle management and control plane functions. The device supports PCIe and DDR4 interfaces for high-bandwidth data movement.
Empfohlen
Medical Imaging and Diagnostics
In medical imaging, the XCZU19EG-1FFVC1760E enables real-time processing of ultrasound, CT, and MRI data. The programmable logic accelerates image reconstruction and filtering, while the ARM cores run the imaging application software. The Mali-400 GPU supports 3D visualization. The device's high logic density and DSP resources handle complex algorithms.
Empfohlen
Wireless Communication Infrastructure
The XCZU19EG-1FFVC1760E is suited for 5G and wireless infrastructure, providing baseband processing and beamforming. The programmable logic implements PHY layer functions, while the ARM cores handle protocol stack and network management. The device supports high-speed serial transceivers for fronthaul/backhaul interfaces. Its processing power enables massive MIMO and advanced modulation schemes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCZU19EG-1FFVC1760E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCZU19EG-2FFVC1760E | XCZU19EG-1FFVC1760I | XCZU19EG-2FFVC1760I | XCZU19EG-L2FFVD1760E |
|---|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5 mm) | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -L2 |
| Temperature Range | 0°C to 100°C (TJ) | 0°C to 100°C (TJ) | Extended industrial | Extended industrial | 0°C to 100°C (TJ) |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Clock | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz |
| Package Code | BGA | BGA | BGA | BGA | BGA |
Wichtigste Unterscheidungsmerkmale
- Higher speed grade option (vs. XCZU19EG-1FFVC1760E)
- Extended temperature range option (vs. XCZU19EG-1FFVC1760E)
- Low-voltage capable option (vs. XCZU19EG-1FFVC1760E)
Designhinweise
The XCZU19EG-1FFVC1760E requires multiple power rails including VCCINT, VCCAUX, and VCCO. Proper power sequencing is critical to prevent damage. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for recommended power-up sequences and decoupling capacitor requirements.
The 1760-FCBGA package dissipates significant heat under full load. A heatsink and forced airflow are recommended for sustained operation. The 0°C to 100°C junction temperature range must be respected. Use thermal vias and copper pours for effective heat spreading.
The 1760-ball FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Follow AMD layout guidelines for DDR4, GTY transceivers, and PCIe interfaces. Use blind and buried vias for routing density.
Compliance-Informationen
Compliance information not provided in verified web data. Contact AMD for RoHS/REACH certification details.
