FPGA & CPLD
Produkte (6666)
A3PE1500-2FG484 - ProASIC3E FPGA, 1.5M Gates | Microchip
The Microchip Technology A3PE1500-2FG484 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 1.5 million system gates, 280 user I/Os, and 276,480 bits of RAM, housed in a 484-ball FBGA package. It operates from a 1.5V core supply and supports commercial temperature range (0°C to 70°C). This device is part of the ProASIC3E family, which offers low power, high security, and instant-on capability due to its flash-based configuration. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3E family uses flash-based configuration cells, which retain the program even when power is removed, providing instant-on operation and inherent security against reverse engineering. This makes them suitable for applications requiring secure boot and tamper resistance. Key features of the A3PE1500-2FG484 include 1.5 million system gates, 280 user I/Os, and 276,480 bits of RAM. It supports up to 16K logic elements (LEs) and includes advanced features such as phase-locked loops (PLLs), SRAM/FIFO, and programmable I/O standards. The flash-based architecture eliminates the need for external configuration memory, reducing system cost and board space. The device also offers low power consumption, with a typical static power of 0.11W, making it ideal for power-sensitive applications. Technically, the ProASIC3E core tile is a VersaTile that can be configured as a three-input lookup table (LUT) or as a D-flip-flop/latch with enable. This flexibility allows efficient use of the FPGA fabric. The device includes up to 6 PLLs, which can be used for clock generation and synchronization. The I/O supports various standards including LVCMOS, LVTTL, PCI, and LVDS, providing interface flexibility. The flash-based configuration also provides immunity to single-event upsets (SEU) in radiation environments, making it suitable for aerospace and defense applications. Typical applications for the A3PE1500-2FG484 include industrial automation, communications infrastructure, medical imaging, and aerospace systems. Its low power and instant-on capability make it suitable for battery-powered portable devices. The 280 I/Os allow interfacing with multiple peripherals, and the embedded RAM can be used for data buffering and FIFO implementation. When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling. The device requires multiple power rails (VCC, VCCPLL, VCCIBx) and careful PCB layout to minimize noise. Use the Microchip Libero SoC design suite for programming and configuration. The flash-based nature allows in-system programming, simplifying field updates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-2FG484.
A3PE1500-2FGG484I - 1.5M-Gate Flash FPGA 484-FBGA | Microchip
The Microchip (Microsemi/Actel) A3PE1500-2FGG484I is a ProASIC3E flash-based FPGA with 1.5 million system gates, up to 280 user I/O in the 484-ball FBGA package, and 504 kbits of true dual-port SRAM, fabricated on a 130-nm 7-layer-metal flash-based CMOS process. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration ROM or volatile SRAM. In the programmable-logic hierarchy, the ProASIC3E family sits under the FPGA umbrella alongside SRAM-FPGA and antifuse alternatives, offering single-chip operation, live-at-power-up (Level 0) behavior, and reprogrammability without a boot device. Key features include a nonvolatile flash fabric that eliminates external configuration flash, low total cost of ownership as an ASIC replacement, support for optional soft ARM processors, and secure ISP programming. The flash cells are inherently resistant to configuration readback and single-event upsets compared with SRAM FPGAs, an advantage in avionics and industrial systems. Technically, the device integrates flash-based logic elements, embedded 4,608-bit true dual-port SRAM blocks totaling 504 kbits, and flexible I/O banks operating at 1.5V core supply with wide-select I/O standards. Maximum system performance reaches approximately 310 MHz, and the architecture supports PCIe-compatible and other high-speed interfaces through soft IP. Typical applications include ASIC prototyping and replacement in consumer, networking/communications, computing, industrial control, and avionics markets, where single-chip, instantly-on programmable logic is valued. Design consideration: I/O banking rules and power supply sequencing for the multiple VCC/VMV domains must be planned early, since the 484-FBGA pinout fixes bank assignments at layout time. This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQs not found in the manufacturer datasheet, as of 2026-09-02.
A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
The Microchip Technology A3PE1500-2FGG676 is a ProASIC3E flash-based FPGA with 1.5 million system gates, 16K logic elements, 444 user I/O, and 276,480 bits of embedded SRAM, delivered in a 676-ball FBGA package. It operates from a 1.425 V to 1.575 V core supply and is rated for a commercial junction temperature range of 0°C to 85°C. This device uses Microchip's 130 nm flash process to provide non-volatile, reprogrammable logic with instant-on behavior and no external configuration PROM. What is an FPGA? A field-programmable gate array is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital logic, from simple state machines to complex system-on-chip functions. FPGAs occupy a layer between fixed-function ASICs and software-defined microprocessors, allowing parallel hardware execution and deterministic I/O timing. In the digital system hierarchy, FPGAs are configurable logic devices with programmable interconnect replacing hardwired gate arrays. The ProASIC3E family is unique in using flash-based configuration cells rather than SRAM LUTs, giving secure, live-at-power-up operation with no boot firmware and eliminating external configuration memory. Key features of the A3PE1500-2FGG676 include 310 MHz system performance, 444 user I/O pins, 276480 bits of true dual-port RAM, and a -2 speed grade that supports high toggle rates for datapath-intensive logic. The flash architecture provides AES-based design security, low total cost of ownership, and reprogrammability through JTAG or the Libero SoC design suite. The 676-ball FBGA package offers a compact 27×27 mm footprint with 1.0 mm ball pitch, allowing dense board assembly while preserving routing access for high-pin-count interfaces. Technically, the ProASIC3E family uses a flash switch fabric that retains its configuration in non-volatile cells. This gives instant-on availability, immunity to bitstream readback attacks, and secure key handling. The device also includes on-chip PLLs and clock conditioning resources, programmable I/O standards, and support for an optional soft ARM Cortex-M1 processor, enabling mixed microcontroller-plus-FPGA designs in a single component. Typical applications include communications infrastructure such as line cards and routers, industrial automation and motor control, aerospace and defense processing platforms, medical imaging equipment, and edge computing systems. The large I/O count and embedded memory suit parallel bus interfacing, frame buffering, and high-speed control logic, while flash-based security is attractive for IP protection. Designers should decouple all VCC and VCCPLL balls with high-frequency ceramic capacitors, route the 1.5 V core supply with a solid power plane, and use Microchip's Libero SoC tool chain for synthesis, place-and-route, and programming. Because the device is flash-based, configuration is retained after power cycling, simplifying production programming and reducing BOM cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate A3PE1500-2FGG676 against A3PE1500-2FGG676I, A3PE1500-1FGG676I, and other ProASIC3E package variants.
A3PE1500-2FGG676I - ProASIC3E FPGA 1.5M Gates 444 I/O | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE1500-2FGG676I is a ProASIC3E family flash-based FPGA delivering 1.5 million system gates, 444 user I/Os, and 310 MHz maximum performance in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.5V core supply at industrial temperature grade (-40C to +100C). A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that designers configure after manufacturing. Unlike SRAM-based FPGAs that require external configuration memory, the ProASIC3E family uses nonvolatile flash technology, storing the configuration on-chip. This places it in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor, and makes it a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets. Key differentiating features include single-chip operation (no external boot PROM, instant-on power-up), reprogrammable flash fabric that is inherently secure against design theft, abundant embedded memory (up to 276480 flash configuration bits per the device listing), optional soft ARM support, and low total cost of ownership per Microchip product literature. The -2 speed grade and dense 444-I/O count support wide parallel buses, memory interfaces, and glueless system integration. Architecturally, the ProASIC3E fabric is built on 130nm CMOS flash technology with VersaTiles - fine-grained logic elements that implement both combinational and sequential functions. Advanced I/O structures support multiple voltage and interface standards, and embedded SRAM blocks plus PLLs provide system-level clock and data buffering without external components. Typical applications include industrial automation controllers, communications and networking line cards, avionics and secure embedded systems, and ASIC prototyping or low-volume ASIC replacement where flash security and instant-on startup matter. Design consideration: 676-ball FBGA packages require careful PCB planning - verify ball-map escape routing, 1.5V core rail integrity with solid power planes, and follow Microchip power-up sequencing guidance before committing the layout. This page synthesizes verified distributor listings, cross-reference data, and practical design notes not found in the manufacturer datasheet.
A3PE1500-2PQG208 - ProASIC3E FPGA, 1.5M Gates, 147 I/O | Microchip
The Microchip Technology (formerly Microsemi) A3PE1500-2PQG208 is a ProASIC3E family flash-based FPGA with 1.5 million system gates, 38400 logic cells/CLBs, 147 user I/Os, and a maximum clock frequency of 350 MHz, housed in a 208-pin plastic quad flat pack (PQFP-208 / BFQFP-208, 28 x 28 mm, 0.5 mm pitch, 3.4 mm height). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration ROM. In the programmable-logic hierarchy (FPGA -> programmable logic device -> digital logic IC -> semiconductor), flash FPGAs occupy the single-chip, instant-on niche: they power up with their configuration already loaded, need no boot device, and offer inherent resistance to configuration corruption from radiation or power glitches. Key features of the A3PE1500 include 1.5V core operation on a 130 nm CMOS process, low total cost of ownership (no external boot flash required), reprogrammability, and embedded block resources with 276480 bits of available memory per the DigiKey listing. The -2 speed grade supports system performance up to 350 MHz, and the ProASIC3E variant adds enhanced I/O and clocking resources versus the base ProASIC3 family. Architecturally, the device is built from VersaTile logic elements (Mouser lists 16K logic elements for the ProASIC3 core), flash switch blocks, and flexible I/O banks supporting multiple single-ended and differential standards at 1.5V supply rails. The flash configuration cell is a true single-chip solution that eliminates configuration PROMs and reduces board area and BOM cost. Typical applications include industrial automation and motor-control interface logic, communications line-card glue logic, aerospace/defense systems that benefit from flash configuration robustness, and secure single-chip designs where bitstream external storage is undesirable. Design consideration: the commercial temperature grade (0C to +70C) of this part means industrial designs should select the -I suffix variant; also budget the 1.5V core supply and separate I/O bank supplies carefully during power-tree design. This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Pricing shown is as of 2026-09-02.
A3PE1500-2PQG208I - ProASIC3E FPGA 1.5M Gates | Microchip
The Microchip Technology A3PE1500-2PQG208I is a ProASIC3E family Field Programmable Gate Array (FPGA) offering 1.5 million system gates, 276,480 total RAM bits, and 147 user I/O pins, housed in a 208-pin PQFP (PQG208) package. It operates from a 1.5V core supply (1.425V to 1.575V) and supports system performance up to 310 MHz, making it suitable for high-volume, low-cost applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs (application-specific integrated circuits) and microprocessors in the design hierarchy. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication, which reduces time-to-market and non-recurring engineering costs. The ProASIC3E family specifically uses flash-based configuration, providing non-volatile, single-chip operation without external boot memory. Key features of the A3PE1500-2PQG208I include 1.5 million system gates, 276,480 bits of RAM, 147 user I/O pins, and a -2 speed grade (310 MHz system performance). The device operates over the industrial temperature range of -40°C to 100°C (TJ) and is RoHS3 compliant. The flash-based architecture offers low power consumption, high security (no bitstream to intercept), and instant-on capability, making it ideal for applications requiring immediate operation on power-up. Technically, the ProASIC3E family is fabricated on a 130nm flash process, which enables non-volatile configuration storage on-chip. This eliminates the need for external configuration PROMs and reduces system cost and board space. The device supports up to 147 user I/Os with various I/O standards, and includes phase-locked loops (PLLs) for clock management. The flash-based design also provides inherent tamper resistance, as the configuration is not stored in external memory. Typical applications include industrial control systems, automotive electronics, medical devices, and communications equipment. The A3PE1500-2PQG208I is particularly suited for designs requiring high reliability, low power, and secure configuration, such as motor control, sensor interfacing, and protocol bridging. Its 1.5M gate density provides ample logic resources for moderate-complexity designs. When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors close to the VCC and GND pins. The 1.5V core supply must be regulated within 1.425V to 1.575V. For I/O banks, follow the recommended termination and voltage levels for the chosen I/O standard to maintain signal integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-2PQG208I for their next design.
A3PE1500-FG676I - ProASIC3E FPGA, 1.5M Gates | Microchip
The Microchip Technology A3PE1500-FG676I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 1.5 million system gates, 38,400 logic cells, and 444 user I/Os, housed in a 676-ball FBGA package. It operates from a 1.5V core supply and supports a maximum internal clock frequency of 350 MHz, making it suitable for high-performance, low-power applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, allowing for custom digital logic designs. FPGAs are part of the programmable logic family, which also includes CPLDs, and are used in a wide range of applications from prototyping to production. The ProASIC3E family is unique in that it uses flash-based configuration, meaning the device retains its programming even when power is removed, eliminating the need for external configuration memory. Key features of the A3PE1500-FG676I include 276,480 bits of embedded RAM, 444 user I/Os, and support for multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS. The device also offers security features such as AES-128 bitstream encryption and a flash lock mechanism to protect the design. The -I suffix indicates an industrial temperature range of -40°C to +100°C, making it suitable for harsh environments. The ProASIC3E architecture uses a flash-based switch matrix that provides instant-on capability and low power consumption. The device includes PLLs for clock management, with up to 6 PLLs available, and supports various configuration modes. The 676-ball FBGA package measures 27mm x 27mm with a 1mm ball pitch, providing a compact solution for high-density designs. Typical applications include industrial automation, automotive electronics, communications infrastructure, and military/aerospace systems. The flash-based nature of the device makes it ideal for applications requiring secure, non-volatile configuration and fast power-up times. When designing with this FPGA, consider the power supply requirements: the core operates at 1.5V, and I/O banks can be configured for various voltages. Proper decoupling and PCB layout are essential for reliable operation at high speeds. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-FG676I.
A3PE1500-FGG48C - 1.5M-Gate ProASIC3E Flash FPGA | Actel
The Actel (Microsemi/Microchip Technology) A3PE1500-FGG48C is a ProASIC3E flash-family FPGA with 1,500,000 system gates, 38,400 VersaTiles of logic, 280 user I/Os, and 276,480 bits of embedded flash memory, housed in a 484-ball Fine-Pitch Ball Grid Array (FGG484) commercial-grade package. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM plus an external configuration ROM. Within the programmable logic hierarchy, the FPGA sits above CPLDs and PAL/GAL devices, and the ProASIC3E family is a single-chip, live-at-power-up solution: no external boot device is required, which reduces bill-of-material cost, board area, and configuration-time security exposure compared with SRAM FPGAs. Key differentiating features of the A3PE1500 include its reprogrammable flash fabric supporting optional soft ARM Cortex-M-based processor implementations, single-chip operation with inherent secure FPGA capability, and low total cost of ownership as highlighted on the Microchip product page. The device supports abundant advanced features typical of the ProASIC3E family, including embedded memory blocks and flexible I/O standards. Architecturally, the fabric is built from VersaTiles - a fine-grained three-input logic element that can implement combinational and sequential functions - fabricated on a standard CMOS flash process. On-chip flash routing and configuration storage eliminate configuration loading and support instant-on behavior, while the family datasheet documents performance suitable for glue logic consolidation, bus bridging, and control-plane functions. Typical applications include industrial automation control, aerospace and defense subsystem logic, communications line-card bridging, and portable instrumentation where a single-chip, secure, non-volatile FPGA lowers system cost. The 484-ball BGA provides sufficient I/O for wide parallel buses and memory interfaces. When designing with the A3PE1500-FGG48C, verify commercial temperature suitability (0C to +70C for the C suffix); industrial applications should select the I-suffix variant, which shares the same die and footprint. Power distribution and BGA decoupling should follow the manufacturer datasheet power supply recommendations. This page synthesizes distributor sourcing data, same-family drop-in temperature and speed-grade variants, and practical design notes not consolidated in the manufacturer datasheet.
A3PE1500-FGG48I - 1.5M-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE1500-FGG48I is a ProASIC3E family flash-based FPGA delivering 1.5 million system gates with up to 280 user I/Os, a maximum system frequency of 231 MHz, and a 1.5V core supply, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package in industrial temperature grade. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions: they configure instantly at power-up, require no external configuration PROM, and are inherently more secure because the bitstream is not stored in external memory. Within the programmable logic hierarchy, the A3PE1500 sits in Microchip's ProASIC3E family (600K to 3M system gates), positioned as a cost-effective ASIC replacement and complement to the Fusion mixed-signal family. Key features include nonvolatile flash programming for instant-on operation, 130 nm flash process technology, reprogrammability for in-field updates, optional soft ARM support via the Cortex-M1 soft core, and abundant embedded memory. The ProASIC3E fabric also supports high-performance interfaces and offers a low total cost of ownership (TOC) per Microchip's product positioning. Architecturally, the device is built on a 130 nm flash process with a sea-of-vanilla-gates style fabric, providing deterministic timing and single-chip secure configuration. The 484-ball FBGA gives dense signal access, supporting the full 280 user I/O count for wide bus interfaces and data-path designs. Typical applications include networking and communications line cards, industrial control, avionics and military subsystems, consumer platforms, and ASIC prototyping or bridge logic, where the 1.5M-gate capacity and flash security matter. Design consideration: as a 1.5V-core device, ensure proper power-rail sequencing and decoupling, and verify I/O bank voltage assignment against your interface standards in Libero SoC before routing. This page synthesizes distributor listings, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices shown are as of 2026-09-02.
A3PE1500-PQG208 - 1.5M Gate ProASIC3E FPGA | Microchip
The Microchip Technology A3PE1500-PQG208 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 1.5 million system gates, 38,400 logic elements, and 147 user I/Os, packaged in a 208-pin PQFP (PQG208) with 0.5 mm pitch. It operates from a 1.5 V core supply and supports system performance up to 350 MHz, making it a high-density, low-power, single-chip solution for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without costly mask revisions. The ProASIC3E family uses flash-based configuration, which means the device retains its programming even when power is removed, providing instant-on operation and enhanced security compared to SRAM-based FPGAs. This places the A3PE1500 within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the A3PE1500-PQG208 include 1.5 million system gates, 38,400 logic elements (equivalent to 16K logic elements per Mouser), 276,480 bits of RAM, and 147 user I/Os. The device supports multiple I/O standards, including LVCMOS, LVTTL, and differential standards, and offers up to 350 MHz system performance. Its flash-based architecture provides low power consumption, with a typical static power of 0.11 W, and supports secure in-system programming (ISP) via JTAG. The ProASIC3E family is built on a 130 nm flash process, offering a balance of density, performance, and cost. The device includes dedicated phase-locked loops (PLLs) for clock management, and its flash configuration cells eliminate the need for external configuration memory, reducing board space and BOM cost. The 208-pin PQFP package measures 28 x 28 mm with a 3.4 mm height, providing a robust, lead-free (green) plastic package suitable for industrial temperature ranges. Typical applications include industrial control, communications infrastructure, avionics, and consumer electronics. The A3PE1500 is particularly suited for designs requiring high reliability, instant-on operation, and security against reverse engineering. Its low power and small footprint make it ideal for portable and battery-powered systems. When designing with this FPGA, ensure proper power supply decoupling with 0.1 uF and 10 uF capacitors near each VCC and GND pin. The device supports multiple I/O banks with independent VCCIO supplies, so plan the power distribution carefully to meet I/O standard requirements. Also, use the JTAG interface for programming and configuration, and consider the thermal characteristics of the PQFP package for high-density designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-PQG208.
A3PE1500-PQG208I - 1.5M Gate ProASIC3E FPGA | Microchip
The Microchip Technology A3PE1500-PQG208I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 1.5 million system gates, 38,400 logic elements, and 147 user I/Os, housed in a 208-pin PQFP (PQG208) package. It operates at a maximum internal frequency of 350 MHz and is built on 130 nm flash technology, offering a single-chip, reprogrammable solution with low power consumption and inherent security features. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs are part of the programmable logic device family, which also includes CPLDs and SoC FPGAs. They consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing implementation of complex digital logic. FPGAs are widely used in applications requiring flexibility, parallel processing, and rapid prototyping, bridging the gap between ASICs and general-purpose processors. Key features of the A3PE1500-PQG208I include 1.5M system gates, 38,400 logic elements (equivalent to 16K LEs), 147 user I/Os, and 276,480 bits of RAM. It supports up to 350 MHz system performance, operates from a 1.5V core supply, and is available in an industrial temperature grade (-40°C to +100°C). The flash-based architecture provides instant-on capability, low power consumption, and design security without external configuration memory. The ProASIC3E family uses a proprietary flash-based switch technology, eliminating the need for boot PROMs and reducing system cost. The device includes on-chip PLLs, SRAM, and programmable I/O standards, making it suitable for a wide range of applications. Its non-volatile configuration ensures the FPGA is ready immediately upon power-up, which is critical for many industrial and automotive systems. Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. The 147 I/Os support various standards such as LVCMOS, LVTTL, and PCI, enabling direct interface to microcontrollers, sensors, and memory. The low power consumption and high reliability make it ideal for battery-powered and mission-critical systems. When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling capacitors near the power pins. The flash-based architecture does not require external configuration, but you must ensure the I/O bank voltages match your interfacing devices. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-PQG208I.
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000-1FG324I is a ProASIC3E family flash-based FPGA with 3 million system gates, 75264 logic cells, and up to 221 user I/Os, operating at a 1.5V core supply with a maximum system frequency of 272 MHz, housed in a 324-ball FBGA package rated for the industrial temperature range of -40C to +85C. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than volatile SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that boot instantly at power-up, require no external configuration PROM, and offer inherently lower total cost of ownership (TOC). Within the programmable logic hierarchy, the A3PE3000 belongs to the ProASIC3E generation of the ProASIC3 flash FPGA family, fabricated on a 130nm process and positioned for high-density system-on-chip integration. Key features include low total cost of ownership, single-chip operation with on-chip flash programming, reprogrammability, small-footprint packaging, and an abundance of advanced features such as support for high-performance 32-bit soft processors in related M1 ProASIC3 variants. The FBGA-324 package provides 221 user I/Os (516096 total usable in larger packages) supporting a broad range of single-ended and differential I/O standards, with certain I/O standards limited on A3PE3000 devices per the manufacturer datasheet. The architecture uses the ProASIC3 VersaTile logic fabric, in which each tile can be configured as a three-input lookup table, a D flip-flop, or latched logic, enabling fine-grained logic, memory, and register implementation without wasting resources. The flash switching technology gives low static power (quiescent supply current in the 25 mA class) and secure, non-volatile configuration. Typical applications include industrial automation and motor control, military and aerospace embedded processing, communications line cards, and test and measurement instruments that require instant-on operation, single-chip integration, and industrial temperature qualification. A key design consideration is power delivery: the 1.5V core rail must be tightly regulated, and designers should budget for the maximum frequency corner (272 MHz) when calculating dynamic power using Microchip Libero SoC power analysis tools. This page synthesizes distributor pricing, verified drop-in alternatives, application guidance, and practical design notes not consolidated in the manufacturer datasheet.
A3PE3000-1FG484 - 3M Gate ProASIC3E FPGA | Microchip
The Microchip Technology A3PE3000-1FG484 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 3 million system gates, 35,000 logic elements, 516,096 bits of true dual-port SRAM, and 341 user I/O signals, supplied in a 484-ball FBGA (FG484) package with 1mm pitch. It uses a 1.5V core supply and is built on a 130nm, 7-layer-metal flash CMOS process. A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic fabric can be programmed after manufacturing to implement arbitrary digital functions. The A3PE3000-1FG484 belongs to the ProASIC3E family, which is a flash-based FPGA family that combines reprogrammability with instant-on, live-at-power-up behavior. In the taxonomy of programmable logic, this part sits at FPGA level, above CPLD and below structured ASIC, while remaining a single-chip semiconductor solution for digital system integration. Key features include 272MHz system performance, 3M system gates, 35K logic elements, 516,096 bits of true dual-port SRAM, and 341 available user I/O pins on the FG484 package. The flash configuration technology eliminates the need for external boot memory, allowing the device to power up immediately and reducing the total cost of ownership. The device is offered in a low-power 1.5V core and is supported by Microchip Libero SoC design tools. The A3PE3000-1FG484 uses a 130nm, 7-layer-metal (6 copper) flash-based CMOS process. The flash cells are reprogrammable, enabling field upgrades and secure bitstream storage without external configuration PROMs. The ProASIC3E family includes global low-skew VersaNet networks for clocks and resets, and supports numerous single-ended and differential I/O standards as defined in the DS0098 datasheet. Typical applications include industrial automation and control, communications infrastructure, medical imaging, automotive electronics, defense and aerospace systems, and IoT edge computing. The instant-on capability is particularly useful in safety-critical systems that must begin processing immediately after power application, while the 3M-gate density is suited to motor control, image processing, protocol bridging, and custom coprocessing tasks. When designing with this FPGA, plan a clean 1.5V core supply with adequate decoupling on all VCC and VCCPLL balls. The 484-ball FBGA package with 1mm pitch requires a controlled BGA fanout strategy. Because the device is flash-based, power sequencing is simpler than SRAM-based FPGAs, but the recommended ramp and sequencing guidelines in the manufacturer datasheet should still be followed. This page synthesizes distributor pricing, drop-in alternative parts, and practical PCB design guidance that are not all published in a single datasheet, enabling faster selection and design-in decisions for the A3PE3000-1FG484.
A3PE3000-1FG484I - ProASIC3E Flash FPGA 3M Gates | Microchip
The Microchip Technology A3PE3000-1FG484I is a ProASIC3E flash-based field programmable gate array (FPGA) with 3 million system gates, 341 user I/Os, 504 kbits (516096 bits) of true dual-port SRAM, and a -1 speed grade supporting up to 272 MHz system performance, housed in a 484-ball FBGA package rated for industrial temperatures. An FPGA (field programmable gate array) is a semiconductor device that implements user-defined digital logic through configurable logic blocks, routing fabric, and I/O cells. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3E family retain their configuration in non-volatile on-chip flash, so the device is live at power-up (Level 0 support) and requires no external configuration PROM - a single-chip solution that reduces bill-of-materials cost and board area. Key features include reprogrammable flash-based CMOS architecture built on a 130-nm, 7-layer metal (6 copper) process, 504 kbits of true dual-port SRAM for FIFOs and buffering, up to 616 user I/Os in the family, and optional soft ARM support, enabling embedded processor implementations within the fabric. The -1 speed grade guarantees timing closure for designs up to 272 MHz, and the flash cells are inherently non-volatile and highly secure, making the device resistant to bitstream readback attacks. The 484-ball FBGA (1 mm pitch, 23 x 23 mm body) provides 341 available user I/Os with multiple I/O standards. Typical applications include industrial automation and motor control, aerospace and defense systems requiring instant-on operation, communications and networking line cards, test and measurement instrumentation, and medical equipment where single-chip, secure configuration storage is valued. Design consideration: use Libero SoC design suite for synthesis and place-and-route, and verify power budgeting for the 1.5V core rail, since flash-based fabric eliminates configuration current but static and dynamic current still scale with design toggle rates. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, giving engineers a complete selection view in one place.
A3PE3000-1FG896 - 3M Gate ProASIC3E FPGA | Microchip
The Microchip Technology A3PE3000-1FG896 is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3E family, offering 3 million system gates, 504 kbits of true dual-port SRAM, and 620 user I/Os in a 896-ball FBGA package. It operates from a 1.5V core supply and supports commercial temperature range (0°C to 70°C). An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike CPLDs, FPGAs typically contain a large array of programmable logic blocks, embedded memory, and I/O elements, making them suitable for complex, high-density designs. The ProASIC3E family is built on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, providing non-volatile, live-at-power-up operation without the need for external configuration memory. Key features include 3 million system gates, 504 kbits of true dual-port SRAM, 620 user I/Os, and support for up to 35K logic elements. The flash-based architecture offers instant-on capability, low power consumption, and enhanced security with no bitstream to intercept. The device supports multiple I/O standards and includes PLLs for clock management. Technically, the A3PE3000-1FG896 integrates a flash switch fabric that retains configuration even when power is removed, eliminating the need for boot PROMs. This single-chip solution reduces board space and total cost of ownership. The 896-ball FBGA package with 1 mm pitch enables high-density routing while maintaining signal integrity. Typical applications include consumer electronics, networking/communications, computing, and avionics systems where reprogrammability, security, and low power are critical. The device is also suitable for ASIC replacement, offering a cost-effective path for medium-volume production. When designing with this FPGA, ensure adequate decoupling on the 1.5V core supply and follow the layout guidelines in the ProASIC3E datasheet to minimize noise and ensure reliable operation. The device supports JTAG programming and in-system reprogramming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-1FG896.
A3PE3000-1FG896I - 3M-Gate Flash FPGA, 620 I/O | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000-1FG896I is a ProASIC3E flash-based FPGA with 3 million system gates, 620 user I/Os, and 272 MHz system performance, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package for industrial temperature ranges. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than an external configuration ROM. This places it in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. Unlike SRAM FPGAs, flash FPGAs are live-at-power-up (Level 0 support) and provide a true single-chip solution with inherent security benefits because the bitstream never needs to be exposed during power-up. Key features include 130-nm, 7-layer metal (6 copper) flash-based CMOS process technology, up to 504 kbits of true dual-port SRAM, and an abundance of advanced I/O standards. The ProASIC3E family adds enhanced clocking resources, multiple PLLs, and support for optional soft ARM Cortex-M1 processor cores, extending the third-generation ProASIC architecture beyond the ProASICPLUS family. Technical depth: the -1 speed grade delivers 272 MHz system performance at a 1.5V core supply, while the FBGA-896 footprint exposes 620 user I/Os for wide-bus data path, memory interface, and bus-bridging designs. VersaTile-based architecture allows each tile to be configured as logic, SRAM, or register functions, giving high effective gate utilization. Typical applications include industrial automation controllers, military and aerospace logic consolidation, communications line cards, and test-and-measurement systems where non-volatile, secure, instant-on configuration is required. Design consideration: the part is end-of-life (December 2026 per distributor data), so new designs should evaluate the low-power A3PE3000L variants or Microchip's newer PolarFire and IGLOO2 families. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000-1FGG324 - 3M-Gate Flash FPGA, 221 I/O | Microchip
The Microchip Technology (Microsemi) A3PE3000-1FGG324 is a ProASIC3E flash-based FPGA delivering 3 million system gates, 221 user I/Os, and 504 kbits of true dual-port SRAM in a 324-ball FBGA package with 1.00 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic cells and routing resources that designers configure to implement custom digital circuits. Within the programmable logic hierarchy, the A3PE3000 belongs to the flash-based FPGA class, positioned above CPLDs in density and below high-end SRAM FPGAs, and sits inside the broader power-and-control logic domain of system-on-board design. Key features of the A3PE3000-1FGG324 include nonvolatile flash-based reprogrammability, which retains the programmed design when power is removed (Instant On, Level 0 support), single-chip operation with no external configuration PROM, and up to 504 kbits of true dual-port SRAM for buffering and FIFO implementations. The device is fabricated on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process and operates from a 1.5V core supply. Technically, ProASIC3E combines a Sea-of-Gates-style fabric of VersaTiles with embedded SRAM blocks, achieving system performance in the hundreds of megahertz range; FindIC lists the family speed at 272 MHz for this grade. The flash switch technology also provides inherent design security compared with SRAM FPGAs, since the bitstream is stored on-chip in nonvolatile memory. Typical applications include industrial automation control, communications and networking line cards, aerospace and defense systems requiring secure instant-on startup, and medical instrumentation where single-chip configuration simplifies the bill of materials. When designing with this part, verify the speed grade (-1) meets your timing closure target in Libero SoC, and plan power distribution for the 1.5V core and 3.3V or 2.5V I/O banks. Pricing shown here reflects distributor data as of 2026-09-02; confirm current stock before ordering. This page synthesizes distributor pricing signals, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, optimized for engineers comparing ProASIC3E family members.
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology A3PE3000-1FGG324I is a ProASIC3E flash-based field programmable gate array (FPGA) with 3 million system gates, 221 user I/Os in the 324-ball FBGA package, and 1.5V core supply (1.425V to 1.575V), fabricated on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. An FPGA (field programmable gate array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and programmable I/O that designers configure in the field. The ProASIC3E family belongs to the flash-based FPGA category, which sits within the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, flash-based parts configure instantly at power-up (Live-at-Power-Up Level 0 support) and operate as true single-chip solutions without an external configuration device. Key features include 3 million system gates, up to 504 kbits of true dual-port SRAM, optional soft ARM support, reprogrammability with low total cost of ownership, and industrial temperature operation. The 324-ball FBGA (19x19 mm, 1 mm pitch) surface-mount package provides 221 user I/Os on this device while the family supports up to 616 user I/Os in larger packages. The ProASIC3E fabric achieves system performance up to approximately 310 MHz and integrates embedded block RAM for FIFOs, buffers, and soft CPU implementations. The flash switch technology is inherently non-volatile and secure against cloning, an advantage over SRAM FPGAs that require bitstream loading. Typical applications include industrial automation control, aerospace and defense systems, communications and networking equipment, and medical instrumentation where single-chip, instant-on, secure programmable logic is required. When designing with this device, verify I/O bank voltage assignments and thermal budget: the junction temperature range is -40C to +100C (TJ), and used differential I/O pairs reduce available single-ended I/O count per the datasheet. This page synthesizes distributor pricing references, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-02; A3PE3000 family listed as Active by distributors with a typical 8-week manufacturer lead time.
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology A3PE3000-1FGG484 is a 3-million-gate ProASIC3E flash-based FPGA with 75,264 logic elements, 341 user I/O, and 516,096 bits of embedded memory, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) measuring 23 x 23 mm with a 1 mm ball pitch. The -1 speed grade device operates from a 1.5V core supply and supports system performance up to 231 MHz on the 130nm flash process. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3E family sits above smaller ProASIC3 parts and is positioned as a single-chip, low-total-cost-of-ownership solution: because the bitstream is stored on-chip, no external flash boot device is required, and the FPGA is inherently secure against bitstream interception. Key features of the A3PE3000-1FGG484 include instant-on power-up (the fabric is active within microseconds of power application), reprogrammability without a microprocessor, low dynamic power from the 1.5V core, and an abundance of advanced features typical of the ProASIC3E family, including embedded memory blocks and support for the Cortex-M1 soft processor in related M1 ProASIC3 variants. The 341 available user I/O support multiple single-ended and differential standards for flexible board-level integration. Architecturally, the device uses Microchip (formerly Actel/Microsemi) 130nm flash technology with a fine-grained fabric of versatile logic elements, routing resources, and distributed embedded flash memory totaling 516,096 bits. The 484-ball FBGA with 1 mm pitch balances I/O density with solderability on standard PCB assembly lines. Typical applications include industrial automation and motor control, aerospace and defense systems requiring non-volatile, secure configuration, medical instrumentation, and communications equipment where single-chip instant-on logic replaces CPLD-plus-FPGA two-chip solutions. When designing with this device, confirm the industrial temperature variant (A3PE3000-1FGG484I) if the end environment exceeds commercial ranges, and budget power distribution for the 1.5V core rail. Pricing on distributor channels is roughly $1,782 per unit for the industrial variant as of 2026-09-02. This page synthesizes distributor pricing, same-footprint drop-in alternatives across the ProASIC3E and ProASIC3L families, and practical design notes not found in the manufacturer datasheet.
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
The Microchip Technology A3PE3000-1FGG484I is a ProASIC3E flash-based FPGA with 3,000,000 system gates, 35,000 logic elements, 504 Kbits of true dual-port SRAM, and 341 user I/O, delivered in a 484-ball FBGA package with 1.0 mm pitch. This industrial-temperature variant is a single-chip, reprogrammable logic device that powers up immediately from its nonvolatile flash configuration. A field-programmable gate array (FPGA) is a semiconductor device whose logic fabric is configured by the designer after manufacturing rather than being fixed at the foundry. FPGAs implement parallel hardware data paths using configurable logic blocks, embedded memory, and programmable routing. ProASIC3E belongs to the flash-based FPGA hypernym, which contrasts with SRAM-based FPGAs that require external configuration memory. Because the configuration is stored in flash cells, the A3PE3000-1FGG484I is live at power-up and offers higher security against readback, simplifying system design and reducing bill-of-materials cost. Key features include a 130-nm, seven-layer-metal (six copper) CMOS process, 1.5 V core supply, system performance up to 231 MHz, and up to 616 user I/O across the family. The 504 Kbit true dual-port SRAM supports simultaneous read/write for FIFOs and multi-clock domain buffering. Flash-based security features and the green FGG finish support lead-free assembly while making the configuration nonvolatile and more resistant to unauthorized readback. Architecturally, the device implements Microsemi/Microchip VersaTile logic elements surrounded by embedded SRAM blocks and programmable I/O. The flash switch fabric is configured in-system via JTAG using Microchip's FlashPro programmer. Since configuration memory is nonvolatile, no boot flash or FPGA configuration controller is required. The part also supports optional soft ARM processor cores for SoC-style designs, per the ProASIC3E datasheet description. Typical applications include industrial motor control, communications line cards, video capture/processing, medical equipment, automotive infotainment, and aerospace interfaces where low cost, low power, and secure flash configuration are needed. With 341 user I/O, it can interface to parallel ADC/DACs, SDRAM controllers, Ethernet PHYs, and custom backplanes. When designing, provide a clean 1.5 V core supply with adequate decoupling at the many VCC balls, and use Microchip Libero SoC software for timing closure and power estimation. For FGG484, thermal relief and ground plane design are important because the BGA has no exposed pad; route the 1.0 mm pitch with microvias or fine trace widths. This page combines distributor-verified pricing, drop-in FBGA-484 alternatives, package diagrams, and practical design notes not printed in the manufacturer datasheet, helping engineers make faster, more confident replacement and procurement decisions.
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
The Microchip Technology A3PE3000-1FGG896 is a ProASIC3E flash-based FPGA featuring 3,000,000 system gates, 75,264 logic cells, and 620 user I/Os, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package at speed grade -1. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3PE3000-1FGG896 sits as a system-gate-class device under the broader FPGA and programmable logic category, part of Microchip (formerly Actel/Microsemi) ProASIC3E third-generation flash family that succeeded the ProASICPLUS family. Key features include single-chip, Instant-On operation enabled by nonvolatile flash technology, reprogrammability without external boot flash, low total cost of ownership (TOC), and ASIC-level unit cost at volume. The flash fabric removes the configuration-time and security concerns of SRAM FPGAs, since the bitstream is stored on-chip and does not need to be loaded at power-up. The ProASIC3E architecture provides high-performance logic fabric with embedded block memory for data buffering and system integration, supporting complex digital designs that previously required an ASIC or an SRAM FPGA plus configuration device. The 896-ball FGG package provides the highest I/O count option in the family, making the 620 available user I/Os suitable for wide bus interfaces and high-pin-count system interconnect. Typical applications include industrial automation and control, communications and networking equipment, medical instrumentation, aerospace and defense systems, and ASIC prototyping where the flash fabric's security and single-chip operation provide system-level benefits. A key design consideration is that the -1 speed grade is the slowest grade in the family; if timing closure is difficult, the -2 grade in the same 896-ball package (A3PE3000-2FGG896) is a same-footprint option. Verify I/O banking rules and power sequencing in the manufacturer datasheet before board layout. This page synthesizes distributor availability, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000-1FGG896I - ProASIC3E Flash FPGA 3M Gates | Microchip
The Microchip Technology A3PE3000-1FGG896I is a ProASIC3E flash-based FPGA delivering 3,000,000 system gates, 75,264 logic cells, 620 user I/Os, and 516,096 bits of embedded RAM, operating at up to 272 MHz from a 1.5 V core supply (1.425 V to 1.575 V) in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with industrial temperature grading. A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000-1FGG896I sits in the high-density tier of the ProASIC3E family, which belongs to the broader class of nonvolatile FPGAs and programmable system-on-chip platforms. Because the configuration is retained in flash, the device powers up instantly as a single-chip solution with no external boot device. Key differentiating features include low total cost of ownership through single-chip integration, reprogrammability in-system, support for high-performance system-level designs, and abundant advanced features beyond the earlier ProASICPLUS generation. The 620 I/O count and 516 Kbit RAM make it suited to wide-bus interfaces and data buffering. Architecturally, the device is built on a 130 nm CMOS flash process with a sea-of-modules fabric, distributed SRAM/FIFO blocks, and flexible I/O banking. The -1 speed grade supports core toggling rates up to 272 MHz, sufficient for pipelined DSP datapaths, protocol engines, and glueless processor interfacing. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring single-chip instant-on logic, and test equipment where 620 I/Os terminate backplanes and sensor arrays. A key design consideration: flash FPGAs trade some raw fabric speed versus the fastest SRAM FPGAs, so verify timing closure at 272 MHz with Microchip Libero SoC before committing the PCB. Plan power distribution for the 1.5 V core rail across the 896-ball array. This page synthesizes distributor pricing, same-footprint drop-in speed-grade and low-power alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip
The Microchip Technology A3PE3000-1PQG208I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 3 million system gates, 147 user I/Os, and 516,096 bits of true dual-port SRAM, housed in a 208-pin PQFP (BFQFP) package. It operates from a 1.5V core supply and supports a system performance of up to 272 MHz, making it a single-chip, live-at-power-up solution for mid-density logic integration. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3E family uses a flash-based configuration cell, which retains the design even when power is removed, eliminating the need for external boot memory and providing instant-on operation. This places the A3PE3000 within the hierarchy: FPGA -> flash FPGA -> ProASIC3E family -> mid-density programmable logic -> semiconductor. Key features include 3 million system gates, 147 user I/Os, 516,096 bits of true dual-port SRAM, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The device supports live-at-power-up operation, meaning it is ready to function immediately upon power application, and offers Level 0 support for secure in-system programming. The 208-pin PQFP package provides a compact footprint for board-level integration while maintaining adequate I/O count for moderate complexity designs. Technically, the ProASIC3E architecture uses a VersaTile core that can be configured as either a three-input lookup table (LUT) or a D-flip-flop/latch with enable, enabling efficient use of the FPGA fabric. The flash-based configuration is non-volatile, providing inherent security against reverse engineering and eliminating the need for configuration PROMs. The device supports 1.5V core operation with 3.3V, 2.5V, and 1.8V I/O standards, offering flexibility in mixed-voltage systems. Typical applications include industrial control, communications infrastructure, automotive electronics, and aerospace systems where reliability, instant-on capability, and security are critical. The 147 user I/Os and 3M gates are well-suited for glue logic, bus interfacing, and moderate digital signal processing tasks. The flash-based architecture is particularly valuable in safety-critical applications requiring deterministic startup behavior. When designing with this device, ensure adequate decoupling on the 1.5V core supply and all I/O banks. The PQFP package requires careful thermal management; a thermal pad or airflow may be necessary for high-utilization designs. Refer to the ProASIC3E datasheet for specific power supply sequencing and programming voltage requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-1PQG208I in their designs.
A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
The Microchip Technology (Microsemi) A3PE3000-2FG324 is a ProASIC3E flash-based FPGA with 3 million system gates (35,000 logic elements), 221 user I/Os, and a system performance rating of 310 MHz, fabricated on a 130 nm flash process and housed in a 324-ball FBGA package measuring 19 x 19 mm. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3E family store their configuration in on-chip flash cells, giving them instant-on, single-chip operation without an external boot configuration device and inherent protection against bitstream readback. Key features of the A3PE3000-2FG324 include reprogrammable flash configuration, a 1.5 V core supply with a tolerance window of 1.425 V to 1.575 V, low total cost of ownership as an ASIC replacement, and support for soft-processor implementations including the 32-bit ARM Cortex-M1 on M1 ProASIC3 family variants. The 324-FBGA surface-mount package provides a compact footprint for space-constrained designs. Architecturally, the ProASIC3E fabric uses VersaTiles - fine-grained logic tiles based on a 130 nm flash switching element - delivering deterministic performance of up to 310 MHz system speed. Embedded block SRAM and abundant routing resources support data-path, communications, and control applications. Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics systems where a cost-effective ASIC replacement with reprogrammability is required. A key design consideration is the supply voltage tolerance: the 1.425 V to 1.575 V window demands a tightly regulated 1.5 V rail, and the 0 C to +85 C junction operating range should be verified against your thermal budget since this commercial-grade part is not automotive qualified. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, verified against distributor listings as of 2026-09-02.