A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
Teilenummer: A3PE3000-2FG324 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.5 | $785,00 |
| 100 | $71 | $7.100,00 |
| 500 | $65 | $32.500,00 |
| 1.000 | $59 | $59.000,00 |
A3PE3000-2FG324 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3E family store their configuration in on-chip flash cells, giving them instant-on, single-chip operation without an external boot configuration device and inherent protection against bitstream readback.
Key features of the A3PE3000-2FG324 include reprogrammable flash configuration, a 1.5 V core supply with a tolerance window of 1.425 V to 1.575 V, low total cost of ownership as an ASIC replacement, and support for soft-processor implementations including the 32-bit ARM Cortex-M1 on M1 ProASIC3 family variants. The 324-FBGA surface-mount package provides a compact footprint for space-constrained designs.
Architecturally, the ProASIC3E fabric uses VersaTiles - fine-grained logic tiles based on a 130 nm flash switching element - delivering deterministic performance of up to 310 MHz system speed. Embedded block SRAM and abundant routing resources support data-path, communications, and control applications.
Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics systems where a cost-effective ASIC replacement with reprogrammability is required.
A key design consideration is the supply voltage tolerance: the 1.425 V to 1.575 V window demands a tightly regulated 1.5 V rail, and the 0 C to +85 C junction operating range should be verified against your thermal budget since this commercial-grade part is not automotive qualified.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, verified against distributor listings as of 2026-09-02.
Drop-in-Alternativen für A3PE3000-2FG324 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-2FG324 (gleiche Bauform und Footprint) – abweichend in Package, Family, System Gates, Operating Temperature, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-2FGG324
✅ Drop-In✓ Auf Lager
$216 / Stück
Datenblatt ansehen →A3PE3000-FG324
✅ Drop-In✓ Auf Lager
$112.3 / Stück
Datenblatt ansehen →A3PE3000-FG324I
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →A3PE3000-FGG324I
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →A3PE3000L-FGG324I
✅ Drop-In✓ Auf Lager
$62.65 / Stück
Datenblatt ansehen →A3PE3000L-1FGG324I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-1FG324
✅ Drop-In✓ Auf Lager
$135.9 / Stück
Datenblatt ansehen →A3PE3000-2FG324 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E |
| Number of Gates | 3000000 |
| Logic Elements | 35000 |
| Number of I/Os | 221 |
| System Frequency (Max) | 310 MHz |
| Process Technology | 130 nm flash |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) |
| Gehäuse / Bauform | 324-BGA (324-FBGA, 19x19 mm) |
| Montagestil | SMD/SMT |
| Betriebstemperatur | 0 C to +85 C (TJ) |
| Packaging | Tray |
| Programmability Type | In-System Reprogrammable Flash |
| Manufacturer Lead Time | 8 weeks |
| RoHS-Status | Non-compliant |
| Product Status | Active |
| Series | A3PE3000 (ProASIC3E) |
A3PE3000-2FG324 324-bga (324-fbga, 19x19 mm) Pinbelegungsleitfaden
Pinbelegung für A3PE3000-2FG324 (324-bga (324-fbga, 19x19 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-2FG324.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-2FG324 ist geeignet für 6 Anwendungs: ASIC Replacement / Prototyping, Networking and Communications Equipment, Avionics and Defense Systems, Industrial Control and Automation, Consumer Electronics, Computing and Embedded Processing.
ASIC Replacement / Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement, and the A3PE3000-2FG324 with 3 million system gates fits mid-complexity ASIC prototypes and low-to-medium-volume production. Its flash-based configuration provides instant-on operation without an external boot device, matching ASIC single-chip system behavior. Designers implement the netlist in Libero SoC, exploiting 35,000 logic elements and 221 I/Os to absorb gate-level designs, then migrate to mask ASIC only when volume justifies it - cutting non-recurring engineering cost and time-to-market.
Empfohlen
Networking and Communications Equipment
With 310 MHz system performance, 221 user I/Os, and fine-grained VersaTile fabric, the A3PE3000-2FG324 handles line-card glue logic, protocol bridging, and data-path functions in networking and communications equipment - a market segment Microchip explicitly targets for ProASIC3E. The 324-ball FBGA with 19x19 mm footprint packs the fabric densely onto line cards where board space is premium, while the flash fabric avoids configuration-load latency at link initialization. A tightly regulated 1.5 V rail within the 1.425 V to 1.575 V window is required to meet timing at full system speed.
Empfohlen
Avionics and Defense Systems
Microchip lists avionics among ProASIC3E target markets, and the flash-based A3PE3000-2FG324 suits this domain because on-chip flash configuration resists bitstream readback and survives radiation-induced configuration upsets better than SRAM fabrics. The 3M-gate capacity implements sensor-interface, bus-interface, and controller functions in a single 19x19 mm chip, reducing board count. For extended-temperature airborne environments, designers should select the industrial-grade A3PE3000-FG324I or A3PE3000L-FGG324I variants, which are pin-compatible drop-ins on the same 324-ball footprint.
Empfohlen
Industrial Control and Automation
In industrial control, the A3PE3000-2FG324 integrates motor-control sequencing, fieldbus interfaces, and custom state machines that discrete logic cannot economically deliver, using its 221 I/Os to connect directly to sensors and actuators. Flash configuration means the FPGA is functional within microseconds of power-up - critical for machinery requiring immediate I/O determinism without a microprocessor boot loader. The 0 C to +85 C junction range covers typical cabinet environments; for cold-warehouse installations below 0 C ambient, the pin-compatible industrial-temperature variants should be specified instead.
Empfohlen
Consumer Electronics
Consumer electronics designs use the A3PE3000-2FG324 as a configurable co-processor for display timing, interface translation, and custom peripherals where ASIC tooling is uneconomic at moderate volumes. Microchip explicitly names the consumer market for ProASIC3E, citing low total cost of ownership and reprogrammability that lets one hardware platform serve multiple product variants via firmware updates. The 19x19 mm 324-FBGA keeps the footprint competitive in slim enclosures, and instant-on flash startup delivers immediate functionality expected in consumer products without external configuration memory.
Empfohlen
Computing and Embedded Processing
In computing platforms, the A3PE3000-2FG324 serves as flexible glue logic between processors, memory, and peripherals, or hosts soft-processor and custom-accelerator logic within its 3M-gate fabric. Related M1 ProASIC3 devices support the 32-bit ARM Cortex-M1 soft processor, and the same fabric concepts apply when embedding controller logic in the A3PE3000. The 310 MHz system speed supports high-throughput data paths, while 221 I/Os bridge legacy and modern bus standards on a single chip, consolidating board-level PLD functions and reducing BOM count in server and storage platforms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-2FG324 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-2FGG324 | A3PE3000-FG324I | A3PE3000L-FGG324I | A3PE3000L-1FG324 |
|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm) | 324-FBGA - same footprint | 324-FBGA - same footprint | 324-FBGA - same footprint | 324-FBGA - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade | -2 | -2 | -1 | L (low power) | L, -1 |
| Operating Temperature | 0 C to +85 C (TJ) | Commercial grade | Industrial (-40 C) | Industrial (-40 C) | Commercial grade |
| RoHS Status | Non-compliant | Compliant (Green) | Non-compliant (standard FBGA) | Compliant (Green) | Non-compliant (standard FBGA) |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V (lower static current) | 1.5 V (lower static current) |
| Power Profile | Standard ProASIC3E static power | Standard | Standard | Low power (L variant) | Low power (L variant) |
Wichtigste Unterscheidungsmerkmale
- Flash-based instant-on configuration without external boot device (vs. SRAM-based competitor FPGAs)
- Highest speed grade (-2) in the 324-ball footprint (vs. A3PE3000-FG324)
- Trade-off: RoHS non-compliant package finish (vs. A3PE3000-2FGG324)
Designhinweise
The A3PE3000-2FG324 requires a 1.5 V core rail regulated within 1.425 V to 1.575 V. Use a low-noise LDO or tightly regulated buck converter with output accuracy of at least +/-3% across load and temperature. The flash fabric draws static power continuously (the L variants reduce this); if battery life or thermal budget is tight, consider the pin-compatible A3PE3000L-FGG324I. I/O bank rails follow the voltage standards selected in Libero SoC - budget each bank separately in your power-tree estimate.
The 324-ball FBGA with 19x19 mm ball pitch requires a dedicated fanout strategy; typical practice is microvia-in-pad or dog-house fanout with at least one buried power plane. Place 100 nF ceramic decoupling capacitors at the package corners covering the core supply balls, plus bulk 10 uF per supply domain. Follow Microchip's ProASIC3E PCB layout guidelines in the family datasheet (document 50003270B) for ball-map breakout and via stitching recommendations.
Two frequent pitfalls: (1) ignoring RoHS status - this part is RoHS non-compliant per distributor data, so it cannot be used in RoHS-mandated builds; substitute A3PE3000-2FGG324 which is pin-identical and lead-free. (2) Ignoring speed grade in timing closure - the -2 grade reaches 310 MHz, but design timing must be verified in Libero SoC SmartTime for your specific implementation; do not assume datasheet maximums apply to your netlist. Also confirm the 0 C to +85 C junction range against your enclosure thermal rise before finalizing the BOM.
Estimated: ProASIC3E power depends heavily on utilization, toggle rate, and I/O switching - obtain an accurate estimate with Microchip's SmartPower tool in Libero SoC before committing to thermal design. With a 19x19 mm BGA and theta_JA driven mostly by board copper, a solid ground plane plus 2 oz outer copper on a 4-layer board typically suffices for moderate designs; above roughly 1.5 W estimated dissipation, add thermal vias under the package and verify junction temperature stays within the 85 C ceiling.
Compliance-Informationen
RoHS non-compliant per Microchip USA distributor data. Lead-free Green variants (FGG suffix, e.g., A3PE3000-2FGG324) are available as drop-in alternatives for compliance-required designs.
