10AS048K2F35E2SG
10AS048K2F35E2SG - 480K Logic Elements SoC FPGA | Intel
Intel 10AS048K2F35E2SG is an Arria 10 SX system-on-chip FPGA integrating dual ARM Cortex-A9 MPCore processors with CoreSight technology, 480,000 logic elements, and a specified 1.5 GHz frequency in a 1152-ball FCBGA package measuring 35 mm by 35 mm. The verified listing identifies 256 KB of memory, CMOS technology, a 0.95 V nominal supply feature, and BGA terminal construction. This combination places programmable logic and processor-based system functionality within one high-density device for embedded processing, communications, industrial control, and signal-processing systems.
An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic, routing, and embedded resources that engineers can program after manufacturing. A system-on-chip FPGA extends that concept by integrating processing subsystems and FPGA fabric on one die. In the system hierarchy, it can be understood as programmable logic fabric combined with an application processor system, a platform device within embedded computing, and ultimately a member of the broader integrated-circuit family. Its value is the ability to implement parallel hardware acceleration, custom interfaces, and control logic alongside software running on embedded processors.
The principal verified features are 480,000 logic elements, a 1.5 GHz stated frequency, and dual ARM Cortex-A9 MPCore processors with CoreSight. The device also provides 256 KB of memory according to the supplied listing and uses 1152-ball BGA packaging. These attributes make it appropriate for designs that require substantial programmable capacity while retaining processor-based control and debug support. The 35 mm by 35 mm body is consistent with a high-ball-count surface-mount package and requires careful PCB escape routing, controlled impedance, thermal analysis, and high-density assembly capability.
The SoC architecture separates software-executed control and management tasks from parallel logic implemented in the FPGA fabric. Custom datapaths, protocol bridges, filtering functions, and interface controllers can operate concurrently, while the ARM subsystem supports operating-system, control, and supervisory workloads. This division helps systems achieve deterministic hardware performance without moving every function into software. Designers still need to validate power integrity, clock distribution, configuration support, boot storage, processor peripherals, and tool compatibility against the complete manufacturer documentation before release.
Typical applications include industrial automation controllers, communications infrastructure, medical diagnostic equipment, test and measurement platforms, aerospace and defense signal processing, and high-performance embedded computing. The 480,000 logic elements provide capacity for multiple parallel functions, while the dual ARM Cortex-A9 MPCore subsystem supports software control. The 1152-ball package is especially suitable for complex boards with many high-speed signals, but it increases routing, inspection, thermal, and assembly constraints compared with smaller FPGA packages.
A key design consideration is that a BGA FPGA cannot be treated as a simple two-leaded component. Engineers must plan the complete footprint, via field, fanout, decoupling network, clocking, configuration interface, and thermal path. Electrical specifications not present in the supplied verification must remain [DATA_NEEDED: parameter name] rather than being inferred. Confirm pinout, transceiver counts, I/O standards, speed grades, operating temperature, power rails, and maximum currents from the official Intel documentation before schematic release.
This page combines the verified distributor specifications, package identity, sourcing links, application context, and design cautions into a concise engineering reference. Pricing and availability are current only as of 2026-09-05; current distributor stock, lifecycle classification, and complete electrical ratings must be confirmed before procurement or design sign-off.
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