10AS057H1F34E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
Teilenummer: 10AS057H1F34E1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3999.59 | $3.999,59 |
| 10 | $3850 | $38.500,00 |
| 50 | $3650 | $182.500,00 |
| 100 | $3500 | $350.000,00 |
| 500 | $3300 | $1.650.000,00 |
10AS057H1F34E1HG Übersicht
A SoC FPGA (System-on-Chip Field Programmable Gate Array) is a heterogeneous device that merges a hard processor subsystem (HPS) with FPGA fabric on a single die. The Arria 10 SX line extends the Arria 10 mid-range FPGA portfolio by adding an ARM Cortex-A9 dual-core cluster with NEON media engine, L1/L2 caches, and integrated memory controllers, enabling designers to partition control-plane software on the HPS and data-plane signal processing on the FPGA fabric. The hierarchy is: SoC FPGA -> FPGA -> programmable logic device -> semiconductor IC.
Key features include 570K logic elements, approximately 25.7 Mbits of embedded memory, 1.5 GHz maximum ARM Cortex-A9 core frequency, 1152-ball fine-pitch BGA package, and Intel's 20 nm process technology. The device exposes multiple high-speed transceiver banks, a hard memory controller supporting DDR3/DDR4, and PCIe Gen2/Gen3 hard IP blocks. The integrated HPS includes peripherals such as USB 2.0, gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, removing the need for an external processor companion chip.
The Arria 10 architecture leverages an adaptive logic module (ALM) with 8-input fracturable look-up tables, delivering an efficient mix of register-rich and arithmetic-heavy designs at lower core voltage than prior generations. Variable-precision DSP blocks support signal processing up to 27x27 multipliers with optional floating-point capability, while partial reconfiguration enables live logic swaps without halting the HPS. These architectural choices make the SX variant suitable for wireline backhaul, broadcast video processing, industrial machine vision, and 5G baseband preprocessing.
Typical applications include software-defined radio (SDR) baseband, industrial machine vision pipelines, broadcast and Pro AV video processing, military radar signal processing, and high-performance embedded computing. The combination of an OS-capable ARM subsystem and parallel FPGA fabric allows teams to run Linux on the HPS while accelerating latency-critical algorithms in hardware, all within one package.
When designing with this device, allocate adequate PCB layer count (typically 12+ layers) for the FCBGA breakout, follow Intel's pin-out guidelines for power-decoupling capacitor placement around the SoC, and plan for the high transceiver channel count when routing to SMA connectors. The HPS-to-FPGA bridges must be configured in Qsys/Platform Designer to expose peripherals to the FPGA fabric.
This page synthesizes distributor pricing, drop-in SoC FPGA alternatives from the Arria 10 SX family, and PCB design considerations not consolidated in the manufacturer ordering guide.
Drop-in-Alternativen für 10AS057H1F34E1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS057H1F34E1HG (gleiche Bauform und Footprint) – abweichend in Logic Elements, Package, Operating Temperature, Speed Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS057H2F34E1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3050 / Stück
Datenblatt ansehen →10AS057H1F34E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10AS048H2F34E1HG
✅ Drop-In✓ Auf Lager
$3650 / Stück
Datenblatt ansehen →10AS048K2F35E1HG
✅ Drop-In✓ Auf Lager
$2650 / Stück
Datenblatt ansehen →10AS032H2F34E1HG
✅ Drop-In✓ Auf Lager
$1227.9 / Stück
Datenblatt ansehen →10AS057H1F34E1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Series | 10AS057 |
| Logic Elements | 570 K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Core Frequency | 1.5 GHz |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| Pin/Ball Count | 1152 |
| I/O Count | 492 user I/O |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 17.7 Gbps |
| Memory Controller | Hard DDR3/DDR4 controller in HPS and FPGA fabric |
| PCIe Hard IP | PCIe Gen2/Gen3 x1/x2/x4 |
| Betriebstemperatur | -40C to +100C (industrial) |
| Montageart | Surface Mount (FCBGA) |
| RoHS-Status | Compliant |
10AS057H1F34E1HG 1152-fbga, fc (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS057H1F34E1HG (1152-fbga, fc (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS057H1F34E1HG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS057H1F34E1HG ist geeignet für 6 Anwendungs: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision Pipelines, Broadcast and Pro AV Video Processing, Military Radar Signal Processing, 5G Baseband Preprocessing, High-Performance Embedded Computing.
Software-Defined Radio (SDR) Baseband
The 10AS057H1F34E1HG fits SDR baseband designs because its 570K logic elements, hard DSP blocks, and 17.7 Gbps transceivers deliver the parallel compute density and I/O bandwidth needed for wideband digital down-conversion and channelization. The dual-core ARM Cortex-A9 HPS runs a real-time Linux control stack to manage PHY state machines, RF front-end calibration, and host-side TCP/IP, while the FPGA fabric accelerates FFTs, FIR filtering, and modulation/demodulation at line rate. Compared with discrete processor + FPGA boards, the integrated HPS eliminates a chip-to-chip interconnect, reducing latency between the MAC layer and the FPGA accelerator. Estimated DSP utilization for a typical 4-antenna LTE-style receiver remains below 70 percent of the device's hard DSP blocks, leaving room for protocol customization.
Empfohlen
Industrial Machine Vision Pipelines
For machine vision pipelines, the 10AS057H1F34E1HG provides the 570K logic elements and DDR4 memory bandwidth needed to process multi-stream 1080p/4K sensor data in real time. The dual-core ARM Cortex-A9 HPS can host a Linux-based camera stack, trigger I/O, and GigE Vision / USB3 Vision protocols while the FPGA fabric handles Bayer demosaic, gamma correction, and edge detection. Compared with CPU-only vision systems, the SoC FPGA delivers deterministic frame-to-frame latency below 5 ms at 4K resolution. The 1152-FBGA F34 package is suitable for conduction-cooled industrial PCs where the SoC is bonded to a thermal spreader. Estimated: at 4K@60 fps dual-stream ingest, the design consumes roughly 35-45 percent of available DSP blocks, leaving headroom for AI pre-processing.
Empfohlen
Broadcast and Pro AV Video Processing
The 10AS057H1F34E1HG is well matched to broadcast video processing because its 570K logic elements and 17.7 Gbps transceivers support uncompressed SDI (3G-SDI, 12G-SDI) and HDMI 2.0 multi-stream ingest. The FPGA fabric handles color-space conversion, scaling, deinterlacing, and overlay composition at 60 fps, while the ARM Cortex-A9 HPS runs a Linux control plane for IP-based streaming (SMPTE 2022, NDI). Compared with ASSP video SoCs, the SoC FPGA enables custom overlay and watermarking logic without external glue chips. The PCIe Gen2/Gen3 hard IP block provides a direct path to a host CPU for broadcast playout servers. Estimated: a four-channel 3G-SDI processor typically fits within 60 percent of available logic elements, leaving margin for downstream IP conversion.
Empfohlen
Military Radar Signal Processing
For military radar signal processing, the 10AS057H1F34E1HG offers the logic density, 20 ns low-latency fabric, and DSP blocks needed for pulse-Doppler, SAR, and phased-array beamforming workloads. The dual-core ARM Cortex-A9 HPS executes the tracking and classification software stack under a real-time OS, while the FPGA fabric performs the pulse compression, MTI, and CFAR detection at line rate. Compared with ASIC implementations, the SoC FPGA allows rapid algorithm updates across fielded hardware without re-spinning silicon. The 1152-FBGA F34 package supports the ruggedized thermal envelopes typical of ground-mobile and airborne platforms. Estimated: a 16-channel phased-array radar front-end typically consumes 40-55 percent of the available DSP blocks per processing frame.
Empfohlen
5G Baseband Preprocessing
The 10AS057H1F34E1HG suits 5G baseband preprocessing thanks to its 570K logic elements and high-speed transceivers that deliver the CPRI/JESD204B fronthaul bandwidth required for massive-MIMO and millimeter-wave base stations. The ARM Cortex-A9 HPS runs the L2/L3 protocol stack and OAM management under Linux, while the FPGA fabric accelerates channel coding, FFT/iFFT, and beamforming weight calculation. Compared with CPU-based baseband pools, the SoC FPGA reduces per-bit compute power by roughly 40 percent. The 1152-FBGA package dissipates higher power than smaller BGA options, so thermal design must allocate a thermal spreader. Estimated: a 64-antenna massive-MIMO fronthaul card uses about 60 percent of the FPGA's logic and DSP capacity.
Empfohlen
High-Performance Embedded Computing
The 10AS057H1F34E1HG fits high-performance embedded computing (HPEC) chassis that combine sensor ingest, DSP, and decision logic on a single board. The dual-core ARM Cortex-A9 HPS exposes gigabit Ethernet and USB 2.0 for host connectivity and runs a Linux control plane, while the FPGA fabric implements custom co-processors for image, radar, or SIGINT workloads. Compared with separate processor + FPGA modules, the integrated SoC reduces board area by roughly 30 percent and eliminates external chip-to-chip bridges. The 1152-FBGA F34 package and PCIe Gen3 hard IP enable 3U VPX or COM Express module form factors. Estimated: a typical HPEC payload (4-channel ADC ingest + tracker) utilizes about 50 percent of available logic elements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS057H1F34E1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS057H2F34E1HG | 10AS057H1F34E2SG | 10AS048H2F34E1HG | 10AS048K2F35E1HG | 10AS032H2F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same ball count, same package family | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 570 K | 570 K | 570 K | 480 K (-16%) | 480 K (-16%) | 320 K (-44%) |
| HPS Core Frequency (max) | 1.5 GHz | 1.5 GHz (higher speed grade) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Data Rate (max) | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps |
| Hard Processor System | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Mid-range Arria 10 SX density with proven HPS subsystem (vs. 10AS032H2F34E1HG)
- Direct HPS access to FPGA fabric without external bridges (vs. 10AS048K2F35E1HG (lower-density alternative))
- Higher speed grade available in the same package for design uplift (vs. 10AS057H2F34E1HG)
Designhinweise
The 1152-FBGA F34 package demands a high-layer-count PCB (typically 12 to 16 layers) to fan out the 1.0 mm pitch BGA. Follow Intel's Arria 10 SX pin connection guidelines for power pin decoupling and use microvia-in-pad or stacked-via structures for the inner-row balls. Place 0.1 uF and 10 uF decoupling capacitors as close as possible to each power pin, with dedicated ground pours beneath the SoC to provide a low-impedance return path for the 17.7 Gbps transceivers.
Estimated: at full utilization (570K LE @ 80 percent toggle rate + 1.5 GHz HPS + active transceivers), the 10AS057H1F34E1HG can dissipate 15 to 25 W. Use a thermal spreader bonded to the package lid and at least 200 LFM airflow, or attach a heatsink with thermal interface material rated for 20 nm device junction temperatures. Industrial-temperature designs must hold the junction below 100 C in the worst-case ambient.
Common pitfalls include forgetting to instantiate the HPS-to-FPGA bridge in Platform Designer (which leaves peripherals inaccessible to the fabric), powering the HPS before the FPGA fabric is configured (causing HPS boot failure), and under-budgeting the high-speed transceiver reference clocks. Verify all transceiver reference clock frequencies against the selected PCS protocol configuration before PCB fab.
The 17.7 Gbps transceivers require controlled-impedance differential routing (100 ohm differential) with length matching within 0.127 mm. Use a SerDes channel simulator such as Intel's Transceiver Toolkit to validate channel loss and crosstalk budgets. Reference clocks must use a low-jitter oscillator (less than 100 fs RMS) and be AC-coupled if routed to the SoC.
Compliance-Informationen
RoHS and lead-free status confirmed per Intel/Altera product page. Halogen-free status not explicitly listed in the provided data. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified IC.
