10AS048H4F34E3LG - Arria 10 SX SoC FPGA 480K LE | Intel
Teilenummer: 10AS048H4F34E3LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2973.71 | $2.973,71 |
| 3 | $2973.71 | $8.921,13 |
| 10 | $2810.5 | $28.105,00 |
| 100 | $2540 | $254.000,00 |
| 500 | $2295 | $1.147.500,00 |
10AS048H4F34E3LG Übersicht
A System on Chip (SoC) FPGA is an integrated circuit that merges a programmable logic fabric with one or more hard processor cores. The Arria 10 SX extends this concept with ARM Cortex-A9 MPCore running up to 1.5 GHz, alongside dedicated floating-point DSP blocks, embedded memory, and high-speed transceivers. This convergence allows system architects to partition time-critical DSP and packet-processing tasks into programmable logic while running operating systems and control planes on the hard processor subsystem.
Key features include 480K logic elements, 28.6 Mbits of embedded memory, 1,518 variable-precision DSP blocks, and 24 transceivers supporting up to 17.4 Gbps. The hard processor system integrates dual ARM Cortex-A9 cores with CoreSight debug, NEON media engine, and a rich set of peripherals including USB, Gigabit Ethernet, and DDR controllers. The device supports 1.5 GHz core fabric speed and is offered in the -3 speed grade with industrial temperature range.
Arria 10 SX devices use a 20nm FinFET process and a unified architecture that allows partial reconfiguration of the FPGA fabric without interrupting the hard processor system. The integrated ARM subsystem benefits from dedicated low-latency paths to the FPGA fabric, enabling tightly coupled co-processing for applications such as wireless baseband and industrial machine vision.
Typical applications include wireless communication infrastructure, broadcast video processing, military radar, medical imaging, and high-performance industrial automation. The Arria 10 SX family is particularly suited for designs that previously required a discrete FPGA plus external processor, as integration reduces board area, power, and BOM complexity.
When designing with this device, engineers should allocate sufficient thermal dissipation for the 35x35 mm FC-FBGA package and observe high-speed serial layout guidelines for the 17.4 Gbps transceivers. Quartus Prime software supports this device family with reference designs and IP cores for common interfaces.
This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AS048H4F34E3LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048H4F34E3LG (gleiche Bauform und Footprint) – abweichend in Package, Temperature Grade, Logic Elements, Process Technology, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048H4F34I3SG
✅ Drop-In✓ Auf Lager
$2580 / Stück
Datenblatt ansehen →10AS048H3F34E2SG
✅ Drop-In✓ Auf Lager
$1558.07 / Stück
Datenblatt ansehen →10AS032H4F34E3LG
✅ Drop-In✓ Auf Lager
$2240 / Stück
Datenblatt ansehen →10AS048H3F34I2SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AS048H3F34E2LG
✅ Drop-In✓ Auf Lager
$1280 / Stück
Datenblatt ansehen →10AS048H4F34E3LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Core Frequency | 1.5 GHz |
| DSP Blocks | 1,518 (variable-precision) |
| Embedded Memory | 28.6 Mbits |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Process Technology | 20 nm |
| Speed Grade | -3 |
| Gehäuse | 1152-pin FC-FBGA (35x35 mm) |
| Montageart | Surface Mount |
| Core Voltage | 0.9 V (nominal) |
| RoHS-Status | Compliant |
| Product Type | System On Chip (SoC) FPGA / IC SOC CORTEX-A9 |
10AS048H4F34E3LG 1152-pin fc-fbga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS048H4F34E3LG (1152-pin fc-fbga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048H4F34E3LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048H4F34E3LG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Broadcast Video Processing, Military Radar and Signal Intelligence, Medical Imaging Systems, Industrial Machine Vision and Inspection, High-Performance Industrial Control.
Wireless Baseband Processing
The 10AS048H4F34E3LG fits wireless baseband systems because its 480K logic elements and 1,518 variable-precision DSP blocks support multi-carrier LTE and 5G NR channelization, while 24 transceivers at up to 17.4 Gbps handle CPRI and eCPRI fronthaul links. The dual ARM Cortex-A9 MPCore at 1.5 GHz runs the MAC scheduler and upper-layer stack. Co-processing between the hard processor system and FPGA fabric via the FPGA-to-HPS bridge enables tight latency budgets under 5 us for HARQ feedback loops.
Empfohlen
Broadcast Video Processing
Broadcast video routers and HEVC/H.264 encoders benefit from the 10AS048H4F34E3LG's combination of 28.6 Mbits embedded memory for line buffering, 1,518 DSP blocks for transform coding, and 17.4 Gbps transceivers for SDI and SMPTE 2022-6/2110 video over IP. The 1.5 GHz ARM Cortex-A9 subsystem manages control plane and network stacks. This SoC FPGA consolidates a discrete FPGA plus external CPU onto a single die, reducing board area by roughly 40% in 1U frame designs.
Empfohlen
Military Radar and Signal Intelligence
Phased-array radar and SIGINT systems use the 10AS048H4F34E3LG because 24 transceivers at 17.4 Gbps interface directly to ADC and DAC sampling at multi-Gsps rates, while 1,518 DSP blocks deliver the FFT and pulse-computation throughput needed for beamforming. The integrated ARM Cortex-A9 subsystem handles track management and protocol offload. Industrial-grade same-package variants exist for harsh-environment deployment.
Empfohlen
Medical Imaging Systems
CT, MRI, and ultrasound imaging platforms leverage the 10AS048H4F34E3LG's 480K logic elements for real-time image reconstruction (back-projection, filtered back-projection, and iterative reconstruction), while 28.6 Mbits embedded memory serves as line buffers and FFT working storage. The dual ARM Cortex-A9 MPCore runs the user interface, DICOM stack, and patient data management. Deterministic latency from FPGA-to-HPS bridges simplifies medical regulatory compliance.
Empfohlen
Industrial Machine Vision and Inspection
High-speed line-scan camera inspection uses the 10AS048H4F34E3LG because 17.4 Gbps transceivers accept CoaXPress and 10 GigE Vision streams, while 1,518 DSP blocks run real-time defect detection algorithms on multi-megapixel frames. The Cortex-A9 HPS orchestrates PLC integration, PROFINET, and EtherCAT. Lower-density same-package variants allow cost-down for slower lines without changing PCB layout.
Empfohlen
High-Performance Industrial Control
Motion controllers and programmable automation controllers benefit from the 10AS048H4F34E3LG's combination of tight FPGA-to-HPS latency for sub-microsecond servo loops and ARM Cortex-A9 cores for SCADA and OPC UA connectivity. 1,518 DSP blocks handle multi-axis inverse kinematics and field-oriented control. Industrial-temperature same-package variants survive -40C to +100C cabinet environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048H4F34E3LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048H4F34I3SG | 10AS048H3F34E2SG | 10AS032H4F34E3LG | 10AS048H3F34I2SG | 10AS048H3F34E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 320,000 | 480,000 | 480,000 |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -2 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Temperature Grade | Commercial (E-suffix) | Industrial (I-suffix) | Commercial (E-suffix) | Commercial (E-suffix) | Industrial (I-suffix) | Commercial (E-suffix) |
| Packaging Format | Tray (G) | Tape and Reel (S) | Tape and Reel (S) | Tray (G) | Tape and Reel (S) | Tray (G) |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade in the 480K LE F34 package (vs. 10AS048H3F34E2SG)
- Tray packaging optimized for low-volume and prototype builds (vs. 10AS048H4F34I3SG)
- Maximum logic density available in the F34 1152-FBGA package option (vs. 10AS032H4F34E3LG)
Designhinweise
The 1152-ball FC-FBGA package has a typical junction-to-ambient thermal resistance around 12-14 C/W with a properly designed 12-layer PCB and thermal via array under the exposed die pad. Provide at least 256 thermal vias in a 16x16 staggered pattern under the package center, and use the top and inner copper planes as heat spreaders. For designs operating near 100C ambient, recommend a heatsink or forced-air cooling. Estimate: junction temperature = ambient + (theta_JA x total power); at 25W total power the rise is roughly 300-350 C/W x 25W = 8-9 C rise, manageable without active cooling.
Use 1.0 mm ball pitch escape routing with microvia stackups; each 1152 BGA fanout requires at least 6 routing layers with HDI microvias. Match length on DDR3/4 interfaces to the HPS subsystem within 50 mil tolerance for the byte lanes. Separate analog supply planes for the transceiver PLLs (VCCPLL) and the FPGA core (VCC) to reduce jitter; place 0.1 uF and 10 uF decoupling within 100 mil of every supply pin.
The 17.4 Gbps transceivers require controlled-impedance differential pairs (typically 100 ohm differential) routed on the top microstrip layer with continuous reference ground beneath. Avoid via transitions on high-speed serial lanes; if a layer change is unavoidable, use back-drilled vias to minimize stub resonance. Target insertion loss below 6 dB at 8.7 GHz Nyquist for 17.4 Gbps links to keep pre-emphasis settings within the recommended range.
Do not confuse Arria 10 SX (SoC with ARM HPS) with Arria 10 GX (FPGA only) when sourcing - the package pinout differs between SX and GX F34 variants. Do not apply I-suffix (industrial) ordering code to a design that needs commercial-only pricing; the I variant is typically 15-25% more expensive. Always verify Quartus Prime device support for the specific ordering code before generating bitstreams.
Compliance-Informationen
RoHS and lead-free confirmed by LG ordering suffix. AEC-Q100 not applicable for FPGAs. Conflict-minerals compliance follows Intel policy.