10AS048K3F35E2SG - Arria 10 SX SoC FPGA 480K LE 1152-FBGA | Intel
Teilenummer: 10AS048K3F35E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3450 | $3.450,00 |
| 10 | $3210 | $32.100,00 |
| 25 | $3050 | $76.250,00 |
| 50 | $2890 | $144.500,00 |
| 100 | $2720 | $272.000,00 |
10AS048K3F35E2SG Übersicht
A System-on-Chip (SoC) FPGA is an integrated circuit that fuses a general-purpose processor subsystem (typically ARM Cortex-A series) with a programmable FPGA fabric, shared high-bandwidth memory interfaces, and hardened peripherals such as PCIe, Ethernet, USB, and DDR controllers. SoC FPGAs sit in the hierarchy as: SoC -> FPGA & CPLD -> programmable logic -> semiconductor, and they are commonly used to consolidate what would otherwise be a discrete CPU plus FPGA board into one device.
Key features of the 10AS048K3F35E2SG include 480K logic elements, embedded high-speed transceivers, 28 nm/20 nm process technology with 0.9 V core, integrated dual ARM Cortex-A9 MPCore cores with CoreSight debug, hard memory controllers supporting DDR4/DDR3 with ECC, and PCIe Gen2 x4/Gen3 capable hard IP blocks. The 1152-FBGA FC package exposes the full transceiver and external memory pin count of the 10AS048 die.
Architecturally, the Arria 10 SX integrates the HPS (Hard Processor System) with the FPGA fabric through coherent high-bandwidth bridges (AXI/FPGA-to-HPS, HPS-to-FPGA) and shared SDRAM controllers. The 20 nm TSMC process allows higher core frequencies (1.5 GHz Cortex-A9) at lower power versus prior 28 nm Stratix/Cyclone SoCs, while the transceiver blocks support multi-gigabit serial links up to 12.5 Gbps depending on speed grade.
Typical applications include 4K video processing and broadcast equipment, radar and EW DSP front-ends, industrial machine vision, 5G fronthaul baseband, military secure computing platforms, and PCIe accelerator cards that need an ARM host plus FPGA co-processing. The combination of ARM Cortex-A9 for control-plane Linux and FPGA for data-plane DSP makes the Arria 10 SX ideal for systems where latency or throughput preclude a separate SBC.
When designing with this device, ensure the PCB has a minimum of 12 layers with proper ground/return-path stitching around the 1152-ball BGA array; thermal management requires an active heatsink because the transceiver-heavy workloads can exceed 30 W. Quartus Prime (Standard) is the supported toolchain with SoC EDS for ARM software development.
This page synthesizes verified distributor pricing, same-family drop-in alternatives from the Arria 10 SX lineup, and practical design notes that go beyond the manufacturer datasheet alone.
Drop-in-Alternativen für 10AS048K3F35E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048K3F35E2SG (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Elements, Mounting Type, Product Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048K3F35E2LG
✅ Drop-In✓ Auf Lager
$3495 / Stück
Datenblatt ansehen →10AS048K2F35E2SG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AS048K2F35E2LG
✅ Drop-In✓ Auf Lager
$4150 / Stück
Datenblatt ansehen →10AS048K3F35I2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1995 / Stück
Datenblatt ansehen →10AS048K2F35I2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AS048K3F35E2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 1.5 GHz |
| Technology Node | 20 nm |
| Core Voltage | 0.9 V |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| Montageart | Surface Mount |
| Hard Processor System (HPS) | Yes (ARM Cortex-A9 dual-core) |
| Transceivers | Yes (multi-gigabit, up to 12.5 Gbps) |
| Memory Interfaces | DDR4/DDR3 with ECC (hard controller) |
| PCIe Hard IP | Gen2 x4 / Gen3 capable |
| Betriebstemperatur | -40C to +100C (industrial grade E2) |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
| Speed Grade | 3 |
| Lead-Free | Yes |
10AS048K3F35E2SG 1152-fbga, fc (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS048K3F35E2SG (1152-fbga, fc (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048K3F35E2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048K3F35E2SG ist geeignet für 6 Anwendungs: 4K Video Processing & Broadcast Equipment, Radar & Electronic Warfare DSP, 5G Fronthaul Baseband Processing, Industrial Machine Vision Systems, PCIe Accelerator Cards, Medical Imaging & Diagnostic Equipment.
4K Video Processing & Broadcast Equipment
The 10AS048K3F35E2SG's 480K logic elements and high DSP block count enable 4K60 video pipeline processing including scaling, deinterlacing, and color space conversion. Its dual ARM Cortex-A9 at 1.5 GHz handles control plane tasks, network control, and on-screen-display rendering, offloading the FPGA fabric. Multi-gigabit transceivers drive 12G-SDI or HDMI 2.0 fanout, while hard DDR4 controllers buffer uncompressed 4K frames. Compared to a discrete CPU+FPGA board, the SoC integration reduces latency for live broadcast workflows and shrinks BOM for video-over-IP encoders.
Empfohlen
Radar & Electronic Warfare DSP
The 10AS048K3F35E2SG is well-suited for radar and EW front-end DSP because of 480K LEs, embedded DSP blocks supporting floating-point and fixed-point FFTs, and multi-gigabit transceivers for ADC/DAC data capture. The ARM Cortex-A9 host runs control software, health monitoring, and message formatting without an external SBC. Hard PCIe Gen2/3 IP enables the board to feed digitized data to a host processor at line rate. Compared to GPU-based alternatives, Arria 10 SX offers lower latency and deterministic timing critical for EW pulse processing.
Empfohlen
5G Fronthaul Baseband Processing
The 10AS048K3F35E2SG's combination of multi-gigabit transceivers (eCPRI and CPRI), hard PCIe Gen3, and dual ARM Cortex-A9 cores makes it a strong fit for 5G fronthaul baseband units. The FPGA fabric handles PHY-layer FFT/iFFT and beamforming, while the ARM host runs MAC scheduling and timing. Hard DDR4 with ECC supports high-bandwidth memory buffering for antenna data. Compared to ASIC-only fronthaul solutions, the SoC FPGA enables field-upgradeable feature sets without respinning silicon.
Empfohlen
Industrial Machine Vision Systems
The 10AS048K3F35E2SG serves industrial machine vision by providing 480K LEs for image processing pipelines including Bayer demosaicing, defect detection, and conveyor tracking. Multi-gigabit transceivers connect to Camera Link, CoaXPress, or GigE Vision cameras; the hard PCIe Gen3 block streams processed frames to a host PC. The dual ARM Cortex-A9 host runs the Linux-based machine vision application stack with deterministic low latency. Compared to discrete CPU+FPGA boards, the SoC reduces BOM and simplifies EMI compliance.
Empfohlen
PCIe Accelerator Cards
The 10AS048K3F35E2SG is a strong fit for PCIe accelerator cards where the hard PCIe Gen3 x8 IP block delivers high host-to-FPGA bandwidth. The FPGA fabric offloads compute kernels such as compression, encryption, or AI inference, while the dual ARM Cortex-A9 manages housekeeping and host-facing APIs. Hard DDR4 with ECC provides high-bandwidth working memory. Compared to discrete FPGA cards without a host, the integrated ARM eliminates the need for a board-level microcontroller or external SBC.
Empfohlen
Medical Imaging & Diagnostic Equipment
The 10AS048K3F35E2SG fits medical imaging equipment such as ultrasound, CT, and MRI front-ends because 480K LEs run beamforming and image reconstruction pipelines with deterministic latency. Multi-gigabit transceivers interface with high-channel-count ADC arrays, while the dual ARM Cortex-A9 host runs control software and display drivers. Hard DDR4 with ECC supports large image buffers with safety-critical error correction. Compared to discrete CPU+FPGA solutions, the SoC consolidation simplifies IEC 60601 compliance and reduces PCB complexity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048K3F35E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048K3F35E2LG | 10AS048K2F35E2SG | 10AS048K2F35E2LG |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Speed Grade | 3 | 3 | 2 (slower Fmax) | 2 (slower Fmax) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Processor Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Temperature Grade | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) | Industrial -40C to +100C (E2) |
| Transceivers | Multi-gigabit (up to 12.5 Gbps) | Multi-gigabit (up to 12.5 Gbps) | Multi-gigabit (lower Fmax at grade 2) | Multi-gigabit (lower Fmax at grade 2) |
| Hard PCIe IP | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable | Gen2 x4 / Gen3 capable |
| Packaging Variant | Standard (SG) | Large reel (LG) | Standard (SG) | Large reel (LG) |
Wichtigste Unterscheidungsmerkmale
- Speed grade 3 timing advantage (vs. 10AS048K2F35E2SG)
- Identical silicon, larger reel packaging (vs. 10AS048K3F35E2LG)
- Single-chip ARM + FPGA integration (vs. Discrete CPU + FPGA board design)
Designhinweise
Estimated: at 0.9 V core, full HPS + FPGA activity, and transceiver-heavy workloads, the 10AS048K3F35E2SG can dissipate 25-35 W. The 1152-FBGA 35x35 mm package requires a thermal interface material (TIM) and an active heatsink with at least 1 m/s airflow; under sustained load, passive cooling alone will likely exceed the 100C junction limit.
Estimated: the 1152-ball FC-FBGA at 1.0 mm ball pitch demands a minimum 12-layer PCB with stacked vias, dedicated ground/power planes, and length-matched differential pairs for transceiver channels. Use the Altera/Intel Arria 10 SX F35 board design guidelines for via-in-pad and stackup recommendations to avoid signal-integrity issues.
Do not mix up 10AS048K3F35E2SG (speed grade 3) with 10AS048K2F35E2SG (speed grade 2) when ordering for timing-critical designs; the grade change requires Quartus Prime timing analysis verification. Also verify the HPS boot configuration pins match your boot source (QSPI flash, SD card, or NAND) since the boot mode resistors are sampled at power-on.
Compliance-Informationen
RoHS compliant per Intel/Altera product page; AEC-Q100 not applicable for FPGAs (use Q100-qualified MCUs if automotive functional safety is required).
