10M25DAF256C8G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
Teilenummer: 10M25DAF256C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $69.01 | $69,01 |
| 10 | $62.5 | $625,00 |
| 100 | $55.2 | $5.520,00 |
| 500 | $49.8 | $24.900,00 |
| 1.000 | $45.3 | $45.300,00 |
10M25DAF256C8G Übersicht
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic architecture, routing, and I/O behaviour can be defined by the user after manufacture through a hardware-description-language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine lookup-table (LUT) based fabric, dedicated memory, multipliers, transceivers, and clock management to implement parallel digital signal processing, glue logic, and bus-bridging functions that would otherwise require multiple discrete ICs.
Key feature highlights for the 10M25DAF256C8G include 25,000 logic elements, 1,728 Kbits (Kb) embedded SRAM, 4 PLLs, 2 hard 12-bit ADCs, and integrated configuration flash that eliminates an external boot PROM. The device supports LVDS, LVCMOS, SSTL, and DDR3 external memory interfaces, with 8 GPIO banks and a low-power core that typically draws under 1 W at moderate toggle rates. Compared with discrete MCU+ASIC solutions, the integrated flash and ADC blocks reduce BOM count and PCB footprint for industrial control designs.
From an architectural standpoint, the MAX 10 family uses an SRAM-based logic fabric backed by non-volatile flash, allowing single-chip instant-on in under 10 ms. Each logic element is a 4-input LUT plus dedicated register, and DSP blocks support 18x18 multiplication with optional accumulation. The dual 12-bit ADCs can sample up to 1 MSPS with up to 17 analog inputs, providing sensor interface capability without an external ADC.
Typical applications include industrial motor control (where the integrated ADC and PWM-friendly I/O simplify drive firmware), factory automation I/O expansion modules, low-cost video bridging and image preprocessing, and consumer display controllers. The 256-FBGA package offers ample I/O for parallel RGB or LVDS panel interfaces in human-machine-interface (HMI) systems.
When designing with the 10M25DAF256C8G, observe the I/O bank supply grouping in the pinout table because mixed-voltage rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) require separate VCCIO pins per bank. Use Intel Quartus Prime (Lite or Standard edition) for synthesis, place-and-route, and programming-file generation, and follow the MAX 10 Power and Thermal Management User Guide for power estimation.
This page synthesizes distributor pricing, package-level drop-in alternatives within the MAX 10 family, and PCB layout notes that are not consolidated in the manufacturer datasheet itself, giving component engineers a single reference for sourcing, replacement, and design validation.
Drop-in-Alternativen für 10M25DAF256C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M25DAF256C8G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M25DAF256C7G
✅ Drop-In✓ Auf Lager
$38.75 / Stück
Datenblatt ansehen →10M25DAF256I8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M50DAF256C8G
✅ Drop-In✓ Auf Lager
$47.85 / Stück
Datenblatt ansehen →10M16DAF256C8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08DAF256C8G
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →10M04DAF256C7G
✅ Drop-In✓ Auf Lager
$9.45 / Stück
Datenblatt ansehen →10M25DAF256C8G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 1,728 Kbits |
| Embedded 18x18 Multipliers | 55 |
| User I/O Count | 178 |
| PLLs | 4 |
| Hard ADC Blocks | 2 (12-bit) |
| Configuration Flash | Internal, non-volatile |
| Process Node | 55 nm TSMC |
| Gehäuse | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Speed Grade | C8 |
| Temperature Grade | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
10M25DAF256C8G 256-ball fbga (17 mm x 17 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 10M25DAF256C8G (256-ball fbga (17 mm x 17 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M25DAF256C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M25DAF256C8G ist geeignet für 6 Anwendungs: Industrial Motor Control and Drive, Factory Automation I/O Expansion Module, Human-Machine Interface (HMI) Display Controller, Low-Cost Video Bridge and Image Preprocessor, Portable / Battery-Powered IoT Gateway, Test and Measurement Instrumentation Front-End.
Industrial Motor Control and Drive
The 10M25DAF256C8G suits 3-axis field-oriented-control (FOC) motor drives because the dual 12-bit 1 MSPS ADCs sample phase currents directly while the 25,000 logic elements hold the FOC state machine and PWM generators. The internal flash eliminates external boot PROM and enables sub-10 ms power-on to torque production, critical for safety stops. Recommended products: 10M25DAF256C8G paired with IRFS7530 MOSFETs and AMC1301 isolated current shunts.
Empfohlen
Factory Automation I/O Expansion Module
In a programmable logic controller (PLC) remote I/O slice the 10M25DAF256C8G provides 178 user I/Os that can be configured per bank for 24 V industrial signal levels, replacing multiple 74-series transceivers. Its small 17 mm x 17 mm FBGA footprint and 1 W typical power ease integration into DIN-rail modules. Recommended products: 10M25DAF256C8G with TLP281 optocouplers and MAX14840E RS-485 transceiver.
Empfohlen
Human-Machine Interface (HMI) Display Controller
The 10M25DAF256C8G drives TFT panels up to 1280x800 with parallel RGB or LVDS thanks to its 178 I/Os and built-in PLL-based pixel clock generation. The integrated configuration flash reduces BOM and boot latency, while 1,728 Kbits of embedded memory support double-buffered frame storage for touch gestures. Recommended products: 10M25DAF256C8G with FT5406 touch controller and SN65LVDS93A LVDS serializer.
Empfohlen
Low-Cost Video Bridge and Image Preprocessor
Camera designs use the 10M25DAF256C8G as a CSI-2 to parallel-RGB or MIPI to Ethernet bridge, exploiting the DSP multipliers for Bayer demosaic and gamma correction. The 55 dedicated 18x18 multipliers handle 720p streams at 30 fps with low latency. Recommended products: 10M25DAF256C8G with MT9V031 image sensor and DP83848 Ethernet PHY.
Empfohlen
Portable / Battery-Powered IoT Gateway
The MAX 10 family consumes under 1 W at moderate toggle rates, and the 10M25DAF256C8G fits battery-powered edge nodes that perform local sensor aggregation before forwarding to BLE or LoRa. Its instant-on from internal flash avoids the long boot times of SRAM FPGAs, extending battery life. Recommended products: 10M25DAF256C8G paired with STM32WB55 host MCU and SX1276 LoRa transceiver.
Empfohlen
Test and Measurement Instrumentation Front-End
Bench instruments use the 10M25DAF256C8G to implement trigger logic, time-interpolators, and display refresh for entry-level oscilloscopes and logic analysers. The 2 hard 12-bit ADCs at 1 MSPS provide cost-effective signal acquisition for low-bandwidth channels. Recommended products: 10M25DAF256C8G with AD8065 front-end amplifier and ADG708 analog mux.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M25DAF256C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M25DAF256C7G | 10M25DAF256I8G | 10M50DAF256C8G | 10M16DAF256C8G | 10M08DAF256C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 50,000 | 16,000 | 8,000 |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 2,736 Kbits | 504 Kbits | 378 Kbits |
| Speed Grade | C8 | C7 | I8 | C8 | C8 | C8 |
| Temperature Grade | Commercial (0 to 85 C) | Commercial | Industrial (-40 to 100 C) | Commercial | Commercial | Commercial |
| Hard ADC | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit |
| Internal Flash | Dual-image | Dual-image | Dual-image | Dual-image | Dual-image | Dual-image |
| Unit Price (qty 1) | USD 69.01 | Lower (slower speed grade) | Higher (industrial grade) | Higher (larger fabric) | Lower (smaller fabric) | Lowest |
Wichtigste Unterscheidungsmerkmale
- Same-package density scaling without PCB rework (vs. 10M16DAF256C8G)
- Industrial temperature grade available in identical package (vs. 10M25DAF256I8G)
- Integrated 12-bit ADC eliminates external ADC BOM (vs. Lattice ECP5 LFE5U-25F-8BG256C)
Designhinweise
Estimated: With 25K LE at 100 MHz toggle and 60% utilization, the MAX 10 core current is approximately 200-400 mA from a 1.2 V supply. Decouple every VCC and VCCIO pin with 100 nF X7R 0402 placed within 2 mm of the ball, plus one 10 uF bulk capacitor per power rail. Use Intel's Early Power Estimator (EPE) before layout to size the DC-DC converters correctly.
The 256-FBGA package has a theta_JA in the range of 15-20 C/W on a 4-layer JEDEC test board. Estimated: at 1.0 W total dissipation, junction temperature rise is approximately 18 C above ambient, so adequate airflow is needed only in enclosed industrial housings. Avoid placing the device directly above heat-generating components and follow the MAX 10 thermal management user guide for thermal via patterns under the BGA.
Use a 4-layer or 6-layer stack-up with continuous GND plane beneath the BGA for return-path integrity. Escape the inner rows of the 1.0 mm pitch BGA with 0.10 mm (4 mil) traces via micro-vias (0.20 mm pad / 0.10 mm drill). JTAG pins TCK, TMS, TDI, TDO must be pulled or terminated per the MAX 10 Configuration User Guide to prevent spurious configuration during power-up.
Do not confuse the 10M25DAF256C8G (dual-image flash) with the 10M25DCF256C8G (single-image flash) or the 10M25SAF256C8G (single-supply analog). Mismatches cause non-functional boards because user flash sectors and remote-update capability differ. Always verify the full OPN against Intel's ordering guide before tape-out. Also confirm that JTAG is not multiplexed with GPIO0 in the pinout file you are using.
For DDR3 or LVDS interfaces above 300 MHz, follow Intel's MAX 10 board design guidelines: 100 ohm differential impedance on LVDS pairs, matched length within 5 mils, and series 2.2 nF AC-coupling capacitors on the receive side. The integrated PLL has a limited VCO range, so select PLL input pin assignments before PCB layout to keep clock routing short.
Compliance-Informationen
RoHS and lead-free status per Intel MAX 10 product family material declaration. Not AEC-Q100 qualified; AEC-Q100 is not applicable for this FPGA family. For automotive designs use the Cyclone IV or Cyclone V families with automotive OPNs.
