157 vs MSC8157SVT1000A Vergleich
Detaillierter Direktvergleich von 157 von Vishay Intertechnology und MSC8157SVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteSpezifikationsvergleich
| Parameter | 157 | MSC8157SVT1000A |
|---|---|---|
| Marke | Vishay Intertechnology | NXP Semiconductors |
| Kategorie | Resistors | DSP |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,40 | $198,40 |
| Housing Diameter | 7/8 in (22.2 mm) | — |
| Resistive Element | Conductive Plastic | — |
| Mount Type | Bushing Mount or Servo Mount (ball-bearing) | — |
| Independent Linearity | +/-0.25% (tightest option) | — |
| Standard Resistance Range | 1 kohm to 100 kohm | — |
| Resistance Tolerance | [DATA_NEEDED: resistance tolerance %] | — |
| Electrical Travel | [DATA_NEEDED: electrical travel in degrees] | — |
| Mechanical Travel | 360 deg continuous | — |
| Power Rating | [DATA_NEEDED: power rating in W] | — |
| Betriebstemperatur | -55C to +125C (typical precision pot range) | -40C to +105C |
| Sealed Version Available | Yes | — |
| Shaft Material | Stainless Steel | — |
| Housing Material | Metal | — |
| Ausgangstyp | Analog voltage (3-wire ratiometric) | — |
| Rotational Life | Long-life (multi-million cycles, conductive plastic) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Datenbusbreite | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Versorgungsspannung | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Pin-Anzahl | — | 783 |
| Lead Free | — | Yes |
| Montageart | — | Surface Mount |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |