157 vs MSC8157SVT1000A Comparaison
Comparaison détaillée côte à côte de 157 par Vishay Intertechnology et MSC8157SVT1000A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteComparaison des spécifications
| Paramètre | 157 | MSC8157SVT1000A |
|---|---|---|
| Marque | Vishay Intertechnology | NXP Semiconductors |
| Catégorie | Resistors | DSP |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $54,40 | $198,40 |
| Housing Diameter | 7/8 in (22.2 mm) | — |
| Resistive Element | Conductive Plastic | — |
| Mount Type | Bushing Mount or Servo Mount (ball-bearing) | — |
| Independent Linearity | +/-0.25% (tightest option) | — |
| Standard Resistance Range | 1 kohm to 100 kohm | — |
| Resistance Tolerance | [DATA_NEEDED: resistance tolerance %] | — |
| Electrical Travel | [DATA_NEEDED: electrical travel in degrees] | — |
| Mechanical Travel | 360 deg continuous | — |
| Power Rating | [DATA_NEEDED: power rating in W] | — |
| Température de fonctionnement | -55C to +125C (typical precision pot range) | -40C to +105C |
| Sealed Version Available | Yes | — |
| Shaft Material | Stainless Steel | — |
| Housing Material | Metal | — |
| Type de sortie | Analog voltage (3-wire ratiometric) | — |
| Rotational Life | Long-life (multi-million cycles, conductive plastic) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Largeur du bus de données | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tension d'alimentation | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Nombre de broches | — | 783 |
| Lead Free | — | Yes |
| Type de montage | — | Surface Mount |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |