A3PE3000L-FGG324 vs A3PE3000L-1FG324I Vergleich
Detaillierter Direktvergleich von A3PE3000L-FGG324 von Microchip Technology und A3PE3000L-1FG324I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AktivMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-FGG324 | A3PE3000L-1FG324I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $86,15 | $135,00 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L Low Power Flash FPGA |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Non-volatile on-chip flash (single chip, secure) |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Betriebsversorgungsspannung | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Gehäuse | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FG324) |
| Montagestil | SMD/SMT | — |
| Betriebstemperatur | 0 C to +70 C (commercial) | -40C to +100C (industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Process Technology | — | 130 nm CMOS flash |
| Low Power Feature | — | Flash*Freeze technology |
| Montageart | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |