BSC9131NJN1HHHB557 vs BSC9131NSE7KHKB Vergleich
Detaillierter Direktvergleich von BSC9131NJN1HHHB557 von NXP Semiconductors und BSC9131NSE7KHKB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BSC9131NJN1HHHB557 | BSC9131NSE7KHKB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | DSP |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Processor Type | QorIQ Qonverge multicore baseband processor | QorIQ Qonverge SoC |
| Processor Category | Embedded MPU / communications processor | Microprocessor IC |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Montageart | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | 0 °C to +105 °C |
| Wärmewiderstand | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| CPU Core | — | 1 core, 32-bit e500 PowerPC |
| CPU Frequency | — | 1 GHz |
| DSP Engine | — | 1 GHz StarCore DSP |
| Accelerator | — | MAPLE-B2F |
| Architecture | — | 32-bit |
| Memory Support | — | DDR3 |
| Schnittstelle | — | IFC |
| Security Feature | — | SEC |
| Gehäuse | — | 520-FCBGA |
| Package Dimensions | — | 21 mm × 21 mm |
| Supplier Price | — | $54.9669 per unit as of 2026-10-23 |
| Reported Supplier Stock | — | 5,760 pieces |
| Lead Time | — | To be confirmed |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |