BSC9131NJN1HHHB557 vs BSC9131NSE7KHKB Comparaison
Comparaison détaillée côte à côte de BSC9131NJN1HHHB557 par NXP Semiconductors et BSC9131NSE7KHKB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | BSC9131NJN1HHHB557 | BSC9131NSE7KHKB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | DSP |
| Statut du cycle de vie | Actif | Actif |
| Processor Type | QorIQ Qonverge multicore baseband processor | QorIQ Qonverge SoC |
| Processor Category | Embedded MPU / communications processor | Microprocessor IC |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Type de montage | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | 0 °C to +105 °C |
| Résistance thermique | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Statut du cycle de vie | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| CPU Core | — | 1 core, 32-bit e500 PowerPC |
| CPU Frequency | — | 1 GHz |
| DSP Engine | — | 1 GHz StarCore DSP |
| Accelerator | — | MAPLE-B2F |
| Architecture | — | 32-bit |
| Memory Support | — | DDR3 |
| Interface | — | IFC |
| Security Feature | — | SEC |
| Boîtier | — | 520-FCBGA |
| Package Dimensions | — | 21 mm × 21 mm |
| Supplier Price | — | $54.9669 per unit as of 2026-10-23 |
| Reported Supplier Stock | — | 5,760 pieces |
| Lead Time | — | To be confirmed |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |