BSC9131NJN1HHHB557 vs BSC9131NSE7KHKB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci BSC9131NJN1HHHB557 disebabkan oleh NXP Semiconductors dan BSC9131NSE7KHKB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
BSC9131NJN1HHHB557 BSC9131NJN1HHHB557 - 800MHz QorIQ Processor | NXP

BSC9131NJN1HHHB557 - 800MHz QorIQ Processor | NXP

BSC9131NJN1HHHB557 ✓ Aktif
NXP Semiconductors
BSC9131NSE7KHKB BSC9131NSE7KHKB - 1GHz QorIQ Qonverge SoC | NXP

BSC9131NSE7KHKB - 1GHz QorIQ Qonverge SoC | NXP

BSC9131NSE7KHKB ✓ Aktif

Pengandingan Spesifikasi

Parametr BSC9131NJN1HHHB557 BSC9131NSE7KHKB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers DSP
Status Lingkungan Hidup Aktif Aktif
Processor Type QorIQ Qonverge multicore baseband processor QorIQ Qonverge SoC
Processor Category Embedded MPU / communications processor Microprocessor IC
Maximum Processor Frequency 800 MHz —
Package Type 520-FCBGA —
Ball Count 520 balls —
Package Technology Flip-chip ball grid array —
Jenis Pemasangan Surface Mount Surface mount
Core Count [DATA_NEEDED: core count] 1 core
Memory Interface [DATA_NEEDED: memory interface type and configuration] —
Network and Serial Interfaces [DATA_NEEDED: network and serial interface list] —
Input Supply Voltage [DATA_NEEDED: input supply voltage range] —
I/O Voltage [DATA_NEEDED: I/O voltage range] —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] 0 °C to +105 °C
Tegangan Panas [DATA_NEEDED: thermal resistance] —
Maximum Junction Temperature [DATA_NEEDED: maximum junction temperature] —
Physical Dimensions [DATA_NEEDED: package dimensions] —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Status Lingkungan Hidup Active; in-stock listing reported by LCSC —
Manufacturer NXP Semiconductors —
CPU Core — 1 core, 32-bit e500 PowerPC
CPU Frequency — 1 GHz
DSP Engine — 1 GHz StarCore DSP
Accelerator — MAPLE-B2F
Architecture — 32-bit
Memory Support — DDR3
Antaramuka — IFC
Security Feature — SEC
Kemasan — 520-FCBGA
Package Dimensions — 21 mm × 21 mm
Supplier Price — $54.9669 per unit as of 2026-10-23
Reported Supplier Stock — 5,760 pieces
Lead Time — To be confirmed
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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