BSC9131NJN1HHHB557 vs BSC9131NSE7KHKB Comparação
Comparação detalhada lado a lado de BSC9131NJN1HHHB557 por NXP Semiconductors e BSC9131NSE7KHKB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | BSC9131NJN1HHHB557 | BSC9131NSE7KHKB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | DSP |
| Status do ciclo de vida | Ativo | Ativo |
| Processor Type | QorIQ Qonverge multicore baseband processor | QorIQ Qonverge SoC |
| Processor Category | Embedded MPU / communications processor | Microprocessor IC |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Tipo de montagem | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | 0 °C to +105 °C |
| Resistência térmica | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Status do ciclo de vida | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| CPU Core | — | 1 core, 32-bit e500 PowerPC |
| CPU Frequency | — | 1 GHz |
| DSP Engine | — | 1 GHz StarCore DSP |
| Accelerator | — | MAPLE-B2F |
| Architecture | — | 32-bit |
| Memory Support | — | DDR3 |
| Interface | — | IFC |
| Security Feature | — | SEC |
| Encapsulamento | — | 520-FCBGA |
| Package Dimensions | — | 21 mm × 21 mm |
| Supplier Price | — | $54.9669 per unit as of 2026-10-23 |
| Reported Supplier Stock | — | 5,760 pieces |
| Lead Time | — | To be confirmed |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |