EP1SGX25DF672I7N vs EP1SGX25DF672I5N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I7N von Intel und EP1SGX25DF672I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1SGX25DF672I7N | EP1SGX25DF672I5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $118,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | 4 to 20 (CDR/SERDES) |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Gehäuse | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | 672-ball FC-FBGA |
| Logic Family | CMOS | CMOS (SRAM-based FPGA) |
| Betriebstemperatur | 0 °C to 85 °C (industrial) | -40C to +85C (Industrial) |
| Lead-Free | Yes | Yes |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Logic Cells (CLBs) | — | 2,566 |
| Core Supply Voltage | — | 1.5 V |
| Max Transceiver Data Rate | — | 3.1875 Gbps |
| Package Body Size | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Total I/O Pins | — | [DATA_NEEDED: total user I/O pin count] |
| Embedded Memory | — | [DATA_NEEDED: TriMatrix memory block count] |