EP1SGX25DF672I7N vs EP1SGX25DF672I5N Comparaison
Comparaison détaillée côte à côte de EP1SGX25DF672I7N par Intel et EP1SGX25DF672I5N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP1SGX25DF672I7N | EP1SGX25DF672I5N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $162,00 | $118,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | 4 to 20 (CDR/SERDES) |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Boîtier | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | 672-ball FC-FBGA |
| Logic Family | CMOS | CMOS (SRAM-based FPGA) |
| Température de fonctionnement | 0 °C to 85 °C (industrial) | -40C to +85C (Industrial) |
| Lead-Free | Yes | Yes |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Logic Cells (CLBs) | — | 2,566 |
| Core Supply Voltage | — | 1.5 V |
| Max Transceiver Data Rate | — | 3.1875 Gbps |
| Package Body Size | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Total I/O Pins | — | [DATA_NEEDED: total user I/O pin count] |
| Embedded Memory | — | [DATA_NEEDED: TriMatrix memory block count] |