EP1SGX25DF672I7N vs EP1SGX25DF672I5N 对比

详细并排对比 EP1SGX25DF672I7N 出自 Intel 和 EP1SGX25DF672I5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N ⚠ 最后一次采购

规格对比

参数 EP1SGX25DF672I7N EP1SGX25DF672I5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $162.00 $118.00
Family Stratix GX Stratix GX
Logic Elements 25,660 25,660
CLBs 2,566 —
Maximum Operating Frequency 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) —
Combinatorial Delay (CLB) 9.48 ns max —
Process Technology 130 nm CMOS 130 nm CMOS
High-Speed Transceiver Channels 4 4 to 20 (CDR/SERDES)
Transceiver Data Rate 500 Mbps to 3.1875 Gbps per channel —
Core Supply Voltage (VCCINT) 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
封装 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch 672-ball FC-FBGA
Logic Family CMOS CMOS (SRAM-based FPGA)
工作温度 0 °C to 85 °C (industrial) -40C to +85C (Industrial)
Lead-Free Yes Yes
RoHS 状态 [DATA_NEEDED: rohs status] Compliant
安装类型 Surface Mount (BGA) Surface Mount
Terminal Form Ball (BGA) —
Number of Terminals 672 —
Logic Cells (CLBs) — 2,566
Core Supply Voltage — 1.5 V
Max Transceiver Data Rate — 3.1875 Gbps
Package Body Size — 33 x 33 mm
Ball Pitch — 1.0 mm
Total I/O Pins — [DATA_NEEDED: total user I/O pin count]
Embedded Memory — [DATA_NEEDED: TriMatrix memory block count]

数据手册与资源

浏览全部产品 创建 BOM 获取报价