EP1SGX25DF672I7N vs EP1SGX25DF672I5N Comparison
Detailed side-by-side comparison of EP1SGX25DF672I7N by Intel and EP1SGX25DF672I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N β Last Time BuySpecification Comparison
| Parameter | EP1SGX25DF672I7N | EP1SGX25DF672I5N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $162.00 | $118.00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | β |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | β |
| Combinatorial Delay (CLB) | 9.48 ns max | β |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | 4 to 20 (CDR/SERDES) |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | β |
| Core Supply Voltage (VCCINT) | 1.5 V | β |
| Supply Voltage Range | 1.425 V to 1.575 V | β |
| Package | 672-ball FineLine BGA (FC-FBGA), 33 Γ 33 mm, 1 mm pitch | 672-ball FC-FBGA |
| Logic Family | CMOS | CMOS (SRAM-based FPGA) |
| Operating Temperature | 0 Β°C to 85 Β°C (industrial) | -40C to +85C (Industrial) |
| Lead-Free | Yes | Yes |
| RoHS Status | [DATA_NEEDED: rohs status] | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | β |
| Number of Terminals | 672 | β |
| Logic Cells (CLBs) | β | 2,566 |
| Core Supply Voltage | β | 1.5 V |
| Max Transceiver Data Rate | β | 3.1875 Gbps |
| Package Body Size | β | 33 x 33 mm |
| Ball Pitch | β | 1.0 mm |
| Total I/O Pins | β | [DATA_NEEDED: total user I/O pin count] |
| Embedded Memory | β | [DATA_NEEDED: TriMatrix memory block count] |