EP2AGX260EF29C5N vs EP2AGX260EF29C6 Vergleich
Detaillierter Direktvergleich von EP2AGX260EF29C5N von Intel und EP2AGX260EF29C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX260EF29C5N | EP2AGX260EF29C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.565,00 | $1.450,00 |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | 0.9 V |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | 0C to +85C (commercial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Montageart | Surface Mount | Surface Mount (flip-chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 244,188 |
| Memory Bits | — | 12,038,144 bits |
| Embedded 18x18 Multipliers | — | 612 |
| LABs (Logic Array Blocks) | — | 10,260 |
| User I/O Pins | — | 372 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Gehäuse | — | 780-ball FC-FBGA (EF29) |
| Design Software | — | Quartus II |