EP2AGX260EF29C5N vs EP2AGX260EF29C6 Comparación
Comparación detallada lado a lado de EP2AGX260EF29C5N por Intel y EP2AGX260EF29C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29C5N | EP2AGX260EF29C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.565,00 | $1.450,00 |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial) | 0C to +85C (commercial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 244,188 |
| Memory Bits | — | 12,038,144 bits |
| Embedded 18x18 Multipliers | — | 612 |
| LABs (Logic Array Blocks) | — | 10,260 |
| User I/O Pins | — | 372 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Encapsulado | — | 780-ball FC-FBGA (EF29) |
| Design Software | — | Quartus II |