EP2AGZ350FH29C3G vs EP2AGZ350FH29I3G Vergleich

Detaillierter Direktvergleich von EP2AGZ350FH29C3G von Intel und EP2AGZ350FH29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ350FH29C3G EP2AGZ350FH29I3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.350,00 $1.450,00
Logic Elements 350,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (Bits) 16,402,944 —
Embedded Memory Blocks [DATA_NEEDED: M9K/M144K block count] —
User I/O Pins 281 —
Transceivers 24 channels Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet)
Transceiver Data Rate (max) 8.5 Gbps —
PCI Express Hard IP 4 x PCIe Gen2 (x1/x4) —
External Memory Interface DDR3 up to 800 MHz, DDR2, QDRII+ —
PLLs 8 (4 enhanced, 4 fast) —
Global Clocks 16 —
Process Node 40 nm TSMC 40 nm
Speed Grade C3 (commercial, slowest) —
Betriebs-Sperrschichttemperatur 0C to +85C —
Gehäuse 780-ball FBGA (HBGA, 29x29 mm) 780-FBGA (FineLine BGA, FH29)
Montageart Surface Mount Surface Mount
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL rating] 3 (per BGA package handling guidelines)
Family — Arria II GZ
Logic Elements (LE) — 350000 (approximately)
User I/O Count — 281
Temperature Grade — Industrial (-40C to +100C)
Betriebstemperaturbereich — -40C to +100C
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Memory Interface — DDR3 with read/write leveling support (family feature)
Embedded Multipliers — 18x18 hardware multipliers (family feature)
Configuration Method — Serial or parallel via Quartus II (family feature)
Lead Free — Yes
Halogenfrei — [DATA_NEEDED: halogen free status]

Datenblätter & Ressourcen

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