EP2AGZ350FH29C3G vs EP2AGZ350FH29I3G 对比
详细并排对比 EP2AGZ350FH29C3G 出自 Intel 和 EP2AGZ350FH29I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ350FH29C3G | EP2AGZ350FH29I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,350.00 | $1,450.00 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | — |
| 工作结温 | 0C to +85C | — |
| 封装 | 780-ball FBGA (HBGA, 29x29 mm) | 780-FBGA (FineLine BGA, FH29) |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | 3 (per BGA package handling guidelines) |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 350000 (approximately) |
| User I/O Count | — | 281 |
| Temperature Grade | — | Industrial (-40C to +100C) |
| 工作温度范围 | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| Lead Free | — | Yes |
| 无卤 | — | [DATA_NEEDED: halogen free status] |