EP2AGZ350FH29C3G vs EP2AGZ350FH29I3G 比較
詳細な並列比較: EP2AGZ350FH29C3G メーカー: Intel および EP2AGZ350FH29I3G メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP2AGZ350FH29C3G | EP2AGZ350FH29I3G |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,350.00 | $1,450.00 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | — |
| 動作接合温度 | 0C to +85C | — |
| パッケージ | 780-ball FBGA (HBGA, 29x29 mm) | 780-FBGA (FineLine BGA, FH29) |
| 実装タイプ | Surface Mount | Surface Mount |
| RoHS ステータス | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSLレベル | [DATA_NEEDED: MSL rating] | 3 (per BGA package handling guidelines) |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 350000 (approximately) |
| User I/O Count | — | 281 |
| Temperature Grade | — | Industrial (-40C to +100C) |
| 動作温度範囲 | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| Lead Free | — | Yes |
| ハロゲンフリー | — | [DATA_NEEDED: halogen free status] |