EP2SGX60EF1152C3 vs EP2SGX60EF1152C4 Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152C3 von Intel und EP2SGX60EF1152C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Letzte BestellmöglichkeitIntel
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60EF1152C3 | EP2SGX60EF1152C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.210,00 | $1.067,86 |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | 717 MHz (max) |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | [DATA_NEEDED: propagation delay exact value] |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Gehäuse | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial, C3 suffix) | 0C to 85C (commercial) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks / CLBs | — | 3022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 534 |
| Number of LABs/CLBs | — | 3022 |
| Package Type | — | 1152-BBGA, FC-FBGA |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | C4 (commercial) |