EP2SGX60EF1152C3 vs EP2SGX60EF1152C4 Comparación
Comparación detallada lado a lado de EP2SGX60EF1152C3 por Intel y EP2SGX60EF1152C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Última compraIntel
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C4 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX60EF1152C3 | EP2SGX60EF1152C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.210,00 | $1.067,86 |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | 717 MHz (max) |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | [DATA_NEEDED: propagation delay exact value] |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Multipliers (18x18) | 252 | — |
| Encapsulado | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0C to +85C (Commercial, C3 suffix) | 0C to 85C (commercial) |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks / CLBs | — | 3022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 534 |
| Number of LABs/CLBs | — | 3022 |
| Package Type | — | 1152-BBGA, FC-FBGA |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | C4 (commercial) |