EP2SGX60EF1152C3 vs EP2SGX60EF1152C4 对比

详细并排对比 EP2SGX60EF1152C3 出自 Intel 和 EP2SGX60EF1152C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60EF1152C3 EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel

EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel

EP2SGX60EF1152C3 ⚠ 最后一次采购
Intel
EP2SGX60EF1152C4 EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C4 ⚠ 最后一次采购

规格对比

参数 EP2SGX60EF1152C3 EP2SGX60EF1152C4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $2,210.00 $1,067.86
Device Family Stratix II GX Stratix II GX
Logic Elements 60,440 —
LABs / CLBs 3,022 —
User I/Os 534 —
Total Memory Bits 2,544,192 —
Number of Transceivers 36 —
Maximum Transceiver Data Rate 6.375 Gbps —
Internal Frequency 717 MHz 717 MHz (max)
Propagation Delay [DATA_NEEDED: propagation delay ns] [DATA_NEEDED: propagation delay exact value]
Core Voltage 1.2 V 1.15 V to 1.25 V
Process Technology 90 nm 90 nm CMOS
Multipliers (18x18) 252 —
封装 1152-ball FC-FBGA (35 x 35 mm) —
安装类型 Surface Mount Surface Mount
工作温度 0C to +85C (Commercial, C3 suffix) 0C to 85C (commercial)
Configuration Memory Interface EPCS serial configuration devices —
RoHS 状态 Compliant Compliant
Lead-Free Yes Yes
Logic Elements (LE) — 60,440
Logic Array Blocks / CLBs — 3022
Total RAM Bits — 2,544,192
User I/O Pins — 534
Number of LABs/CLBs — 3022
Package Type — 1152-BBGA, FC-FBGA
Package Pitch — 1.0 mm
Speed Grade — C4 (commercial)

数据手册与资源

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