EP2SGX60EFI1152 vs EP2SGX60EF1152I3N Vergleich

Detaillierter Direktvergleich von EP2SGX60EFI1152 von Intel und EP2SGX60EF1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX60EFI1152 EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 Obsolete

Spezifikationsvergleich

Parameter EP2SGX60EFI1152 EP2SGX60EF1152I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1.195,00
Manufacturer Intel —
Product Type Field Programmable Gate Array (FPGA) —
Family Stratix II GX Stratix II GX
Configuration Type Enhanced Configuration (EPC) device —
Logic Elements 60,440 —
Configuration-related Memory 2,544,192 bits —
User I/O 534 —
LAB Count 3,022 LABs —
Gehäuse 1,152-ball FineLine BGA —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
Speed Grade [DATA_NEEDED: speed grade] —
Versorgungsspannung [DATA_NEEDED: supply voltage] —
Transceiver Count [DATA_NEEDED: transceiver count] —
Package Dimensions [DATA_NEEDED: package dimensions] —
RoHS-Status unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Lead-free Status unknown —
Halogen-free Status unknown —
Device Type — Field-Programmable Gate Array (FPGA)
Logic Elements (LEs) — 60,440
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory Bits — 2,544,192 bits
Internal Frequency (max) — 717 MHz
Process Technology — 90 nm
Core Voltage — 1.2 V
Package Type — 1152-ball FC-FBGA
Package Size — 35 x 35 mm (1 mm ball pitch)
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial (-40C to +100C junction)
Lead-Free — Yes
MSL-Level — [DATA_NEEDED: MSL level]

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