EP2SGX60EFI1152 vs EP2SGX60EF1152I3N 비교

다음의 상세 나란히 비교: EP2SGX60EFI1152 제조: Intel 및 EP2SGX60EF1152I3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Intel
EP2SGX60EFI1152 EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 Obsolete

사양 비교

파라미터 EP2SGX60EFI1152 EP2SGX60EF1152I3N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Obsolete Obsolete
재고 상태 In Stock In Stock
단가 (USD) $0.00 $1,195.00
Manufacturer Intel —
Product Type Field Programmable Gate Array (FPGA) —
Family Stratix II GX Stratix II GX
Configuration Type Enhanced Configuration (EPC) device —
Logic Elements 60,440 —
Configuration-related Memory 2,544,192 bits —
User I/O 534 —
LAB Count 3,022 LABs —
패키지 1,152-ball FineLine BGA —
실장 유형 Surface Mount Surface Mount (BGA)
동작 온도 [DATA_NEEDED: operating temperature range] —
Speed Grade [DATA_NEEDED: speed grade] —
공급 전압 [DATA_NEEDED: supply voltage] —
Transceiver Count [DATA_NEEDED: transceiver count] —
Package Dimensions [DATA_NEEDED: package dimensions] —
RoHS 상태 unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Lead-free Status unknown —
Halogen-free Status unknown —
Device Type — Field-Programmable Gate Array (FPGA)
Logic Elements (LEs) — 60,440
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory Bits — 2,544,192 bits
Internal Frequency (max) — 717 MHz
Process Technology — 90 nm
Core Voltage — 1.2 V
Package Type — 1152-ball FC-FBGA
Package Size — 35 x 35 mm (1 mm ball pitch)
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial (-40C to +100C junction)
Lead-Free — Yes
MSL 레벨 — [DATA_NEEDED: MSL level]

데이터시트 & 자료

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