EP3C16U256C7 vs EP3C16U256C8N Vergleich
Detaillierter Direktvergleich von EP3C16U256C7 von Intel und EP3C16U256C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16U256C7 | EP3C16U256C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 15,408 | 15,408 |
| Embedded RAM | 516,096 bits | — |
| User I/O Count | 168 | — |
| Gehäuse | 256-LFBGA | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Maximale Taktfrequenz | 437.5 MHz | — |
| Manufacturer | Intel/Altera | — |
| Series | Cyclone III | — |
| Montageart | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| I/O Standard Options | [DATA_NEEDED: supported I/O standards] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Configuration Scheme | [DATA_NEEDED: supported configuration schemes] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 65 nm low-power |
| Speed Grade | — | 8 (C8, commercial) |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +85 °C |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| RoHS-Status | — | Compliant (Pb-free) |