EP3C25F324I7N vs EP3C25F324I7 Vergleich
Detaillierter Direktvergleich von EP3C25F324I7N von Intel und EP3C25F324I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7N | EP3C25F324I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,20 | $64,80 |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | 66 | 66 |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Gehäuse | 324-ball FBGA (Fine-Pitch BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Passive Serial (PS), Active Serial (AS), JTAG |
| Speed Grade | 7 (slower speed grade, lower power) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 1,539 |
| Maximum User I/O | — | 215 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +100 °C (industrial) |
| Montageart | — | Surface Mount |