EP3C25F324I7N vs EP3C25F324I7 Comparación
Comparación detallada lado a lado de EP3C25F324I7N por Intel y EP3C25F324I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324I7N | EP3C25F324I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,20 | $64,80 |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | 66 | 66 |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Encapsulado | 324-ball FBGA (Fine-Pitch BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Passive Serial (PS), Active Serial (AS), JTAG |
| Speed Grade | 7 (slower speed grade, lower power) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 1,539 |
| Maximum User I/O | — | 215 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Tipo de montaje | — | Surface Mount |