EP3C25F324I7N vs EP3C25F324I7 对比

详细并排对比 EP3C25F324I7N 出自 Intel 和 EP3C25F324I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C25F324I7N EP3C25F324I7
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $58.20 $64.80
Family Cyclone III —
Logic Elements (LEs) 24,624 24,624
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers 66 66
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 4
Global Clock Networks 20 20
Process Technology 65 nm TSMC 65 nm low-power CMOS
Core Voltage 1.2 V —
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
封装 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
工作温度 -40C to +100C (Industrial) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) Passive Serial (PS), Active Serial (AS), JTAG
Speed Grade 7 (slower speed grade, lower power) —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
MSL 等级 3 (168 hours) —
Series — Cyclone III
Logic Array Blocks (LABs) — 1,539
Maximum User I/O — 215
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
工作结温 — -40 °C to +100 °C (industrial)
安装类型 — Surface Mount

数据手册与资源

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