EP3CLS200F484C8N vs EP3CLS200F484C8 Vergleich

Detaillierter Direktvergleich von EP3CLS200F484C8N von Intel und EP3CLS200F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS200F484C8N EP3CLS200F484C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.245,00 $118,00
Series Cyclone III LS Cyclone III LS
Family Cyclone® III LS Cyclone III LS (low-power Cyclone III)
Logic Elements 198,464 —
Embedded Memory 8,211,456 bits (8.21 Mbit) 8,211,456 bits (approx 8 Mbit)
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count] —
Embedded Multipliers (18x18) 396 —
User I/O Pins 210 —
Number of PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V 1.2 V
Process Technology 65 nm CMOS, low-leakage 65 nm low-power CMOS
Maximum Operating Frequency 402 MHz (fabric) —
Gehäuse 484-ball FBGA (FineLine BGA), 23 x 23 mm 484-pin FBGA (FineLine BGA)
Speed Grade 8 (slowest) —
Temperature Grade Commercial (0C to +85C TJ) —
Bitstream Encryption AES-128 (256-bit key via separate license) —
Configuration Mode Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG —
RoHS-Status Compliant Compliant
Montageart Surface Mount (BGA) Surface Mount
Logic Elements (LE) — 198,464
Logic Array Blocks (LAB) — 20,5056 (approx)
Embedded 18x18 Multipliers — 210
PLLs — 4
Maximum User I/O — 304
I/O Banks — 8
Package Dimensions — 23 mm x 23 mm, 1.0 mm ball pitch
Configuration Modes — AS, PS, FPP, JTAG
Security — Design encryption / bitstream AES
Betriebstemperatur — 0C to +85C (commercial, 'C' suffix)

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